Novel polymer design for ultra-low stress material for advanced packaging applications

F. Meyer; M. Koch; K. Nishikawa; G. Larbig; K. Taniguchi

doi:10.1117/12.2658391

30 April 2023 Novel polymer design for ultra-low stress material for advanced packaging applications

F. Meyer, M. Koch, K. Nishikawa, G. Larbig, K. Taniguchi

Proceedings Volume 12498, Advances in Patterning Materials and Processes XL; 124981R (2023) https://doi.org/10.1117/12.2658391
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Conference Poster

Abstract

Multi-RDL architectures in WLP are pushing established materials like polyimide to their limits. Key limitations of these material are high temperature curing and shrinkage which leads to warpage and yield losses. We are developing a dielectric packaging material that has minimal stress upon curing while being compatible with established packaging processes. Another goal is to keep dielectric constant and loss factor as low as possible to ensure compatibility with high frequency applications. Additional feature for this new polymer class is high temperature stability.

Citation Download Citation

F. Meyer, M. Koch, K. Nishikawa, G. Larbig, and K. Taniguchi "Novel polymer design for ultra-low stress material for advanced packaging applications", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 124981R (30 April 2023); https://doi.org/10.1117/12.2658391

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available