Thermal investigations on LED modules realized using solderless assembly for electronics technology

Ciprian Ionescu; Bogdan Mihăilescu; Mihai Brânzei; Gaudentiu Vărzaru

doi:10.1117/12.2643171

2 March 2023 Thermal investigations on LED modules realized using solderless assembly for electronics technology

Ciprian Ionescu, Bogdan Mihăilescu, Mihai Brânzei, Gaudentiu Vărzaru

Proceedings Volume 12493, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies XI; 124931U (2023) https://doi.org/10.1117/12.2643171
Event: Advanced Topics in Optoelectronics, Microelectronics and Nanotechnologies 2022, 2022, Constanta, Romania

Abstract

This work is derived from our recent studies about the new approach for interconnecting the electronic components without the use of solder alloys. The concept is generally called Solderless Assembly for Electronics Technology (SAFE). We will present the results of thermal analysis and measurements of electronic modules that were realized in SAFE technology. In a SAFE module, the natural convection from the top of a component is blocked by the resin, as a result of molding process. The interconnection of components and simultaneously the conductive tracks are realized using the same printed conductive paste. Having interconnections with higher resistance, supplemental to the heat generation in electronic components, in our case resistors and LEDs, will be added to the supplemental dissipation caused by the current flow.

Citation Download Citation

Ciprian Ionescu, Bogdan Mihăilescu, Mihai Brânzei, and Gaudentiu Vărzaru "Thermal investigations on LED modules realized using solderless assembly for electronics technology", Proc. SPIE 12493, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies XI, 124931U (2 March 2023); https://doi.org/10.1117/12.2643171

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