Paper
25 August 2006 Challenges and perspectives of printed electronics
G. Schmidt, H. Kempa, U. Fuegmann, T. Fischer, M. Bartzsch, T. Zillger, K. Preissler, U. Hahn, A. Huebler
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Abstract
Based on the achievement of having fabricated the first integrated circuit solely by means of conventional mass-printing methods, we report on the challenges and perspectives of printed electronics as far as fast, continuous printing processes are taken into account. We have identified a number of issues that have to be addressed when conventional printing is adapted in order to print electronic devices and integrated circuits thereof from solutions of functional organic materials. We report on our results of evaluation of various printing methods, i.e. offset, gravure and flexographic printing, and their suitability for the individual layers. The choice of the combination of printing techniques and the adjustment of the process parameters largely influence the performance of printed electronic devices and integrated circuits. We finally comment on the conclusions that can be drawn from the results of our printing experiments about the future potential of printed electronics.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
G. Schmidt, H. Kempa, U. Fuegmann, T. Fischer, M. Bartzsch, T. Zillger, K. Preissler, U. Hahn, and A. Huebler "Challenges and perspectives of printed electronics", Proc. SPIE 6336, Organic Field-Effect Transistors V, 633610 (25 August 2006); https://doi.org/10.1117/12.680256
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Cited by 3 scholarly publications.
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KEYWORDS
Printing

Electronics

Dielectrics

Electronic components

Integrated circuits

Transistors

Semiconductors

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