Recent Advances In Automated Patterned Wafer Inspection

Rod Browning; Ian Lincoln; Peter Stonestrom

doi:10.1117/12.953117

19 July 1989 Recent Advances In Automated Patterned Wafer Inspection

Rod Browning, Ian Lincoln, Peter Stonestrom

Proceedings Volume 1087, Integrated Circuit Metrology, Inspection, and Process Control III; (1989) https://doi.org/10.1117/12.953117
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

An automated patterned wafer inspection system has been developed with submicron sensitivity which is capable of inspecting a complete 150mm wafer in less than three and a half minutes. The system was designed to be used on-line in a production environment to assist the process engineer in identifying critical yield limiting process steps. The system can be interfaced to an automated off-line defect review microscope which allows for the classification of defects. An overview of the optical system and unique signal processing techniques will be presented. Performance results on a variety of different process levels on various types of patterned wafers will be discussed.

Citation Download Citation

Rod Browning, Ian Lincoln, and Peter Stonestrom "Recent Advances In Automated Patterned Wafer Inspection", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); https://doi.org/10.1117/12.953117

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