Precision Measurements Of Material-Removal Rates In Superpolishing Sapphire

B. Hader; O. Weis

doi:10.1117/12.949456

11 April 1989 Precision Measurements Of Material-Removal Rates In Superpolishing Sapphire

B. Hader, O. Weis

Proceedings Volume 1015, Micromachining Optical Components and Precision Engineering; (1989) https://doi.org/10.1117/12.949456
Event: 1988 International Congress on Optical Science and Engineering, 1988, Hamburg, Germany

Abstract

As we demonstrate, sapphire can be polished by means of colloidal SiO2 (7 nmφ) in water by direct contact to a tin lap to a residual roughness better than 0.3 nm Rz measured with a Talystep profilometer. We use the superpolishing mechanism itself for producing microscopically smooth grooves which can serve for a precision measurement of the very small removal rates intrinsic to the superpolishing process. In order to explain the superpolishing process, we propose the model of hydrothermal wear.

Citation Download Citation

B. Hader and O. Weis "Precision Measurements Of Material-Removal Rates In Superpolishing Sapphire", Proc. SPIE 1015, Micromachining Optical Components and Precision Engineering, (11 April 1989); https://doi.org/10.1117/12.949456

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