Compact 2D OPC modeling of a metal oxide EUV resist  for a 7nm node BEOL layer

Adam Lyons; David Rio; Sook Lee; Thomas Wallow; Maxence Delorme; Anita Fumar-Pici; Michael Kocsis; Peter de Schepper; Michael Greer; Jason K. Stowers; Werner Gillijns; Danilo De Simone; Joost Bekaert

doi:10.1117/12.2260441

27 March 2017 Compact 2D OPC modeling of a metal oxide EUV resist for a 7nm node BEOL layer

Adam Lyons, David Rio, Sook Lee, Thomas Wallow, Maxence Delorme, Anita Fumar-Pici, Michael Kocsis, Peter de Schepper, Michael Greer, Jason K. Stowers, Werner Gillijns, Danilo De Simone, Joost Bekaert

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Proceedings Volume 10143, Extreme Ultraviolet (EUV) Lithography VIII; 101431E (2017) https://doi.org/10.1117/12.2260441
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

Inpria has developed a directly patternable metal oxide hard-mask as a high-resolution photoresist for EUV lithography1. In this contribution, we describe a Tachyon 2D OPC full-chip model for an Inpria resist as applied to an N7 BEOL block mask application.

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Adam Lyons, David Rio, Sook Lee, Thomas Wallow, Maxence Delorme, Anita Fumar-Pici, Michael Kocsis, Peter de Schepper, Michael Greer, Jason K. Stowers, Werner Gillijns, Danilo De Simone, and Joost Bekaert "Compact 2D OPC modeling of a metal oxide EUV resist for a 7nm node BEOL layer", Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 101431E (27 March 2017); https://doi.org/10.1117/12.2260441

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