Presentation + Paper
24 March 2017 Sensitivity enhancement of the high-resolution xMT multi-trigger resist for EUV lithography
Author Affiliations +
Abstract
Irresistible Materials is developing a new molecular resist system that demonstrates high-resolution capability based on the multi-trigger concept. A series of studies such as resist purification, developer choice,and enhanced resist crosslinking were conducted in order to optimize the performance of this material. The optimized conditions allowed patterning 14 nm half-pitch (hp) lines with a line width roughness (LWR) of 2.7 nm at the XIL beamline of the Swiss Light source. Furthermore it was possible to pattern 14 nm hp features with dose of 14 mJ/cm2 with an LWR of 4.9 nm. We have also begun to investigate the addition of high-Z additives to EUV photoresist as a means to increase sensitivity and modify secondary electron blur.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Carmen Popescu, Andreas Frommhold, Alexandra McClelland, John Roth, Yasin Ekinci, and Alex P. G. Robinson "Sensitivity enhancement of the high-resolution xMT multi-trigger resist for EUV lithography", Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 101430V (24 March 2017); https://doi.org/10.1117/12.2258098
Lens.org Logo
CITATIONS
Cited by 5 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Line edge roughness

Metals

Extreme ultraviolet lithography

Standards development

Line width roughness

Optical lithography

Photoresist materials

Back to Top