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10 June 2024 Radiative cooling and two-phase cooling architectures for high-power electronics
Peter Bermel
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Proceedings Volume PC13027, Energy Harvesting and Storage: Materials, Devices, and Applications XIV; PC1302703 (2024) https://doi.org/10.1117/12.3013811
Event: SPIE Defense + Commercial Sensing, 2024, National Harbor, Maryland, United States
Abstract
High frequency, and high power, radar and communications systems rely on high power amplifiers (HPAs) to increase signal strength immediately before it reaches the antenna. The heat generated in these devices quickly outpaces the heat removal capabilities of air-cooled architectures. Therefore, a variety of novel cooling approaches are needed to meet the needs for such high-power electronics. In this talk, we consider two methods - radiative cooling and two-phase cooling - with the potential to provide additional cooling power needed to achieve such goals, and also provide specific modeling and experimental results to quantify the performance improvements associated with this strategy.
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Peter Bermel "Radiative cooling and two-phase cooling architectures for high-power electronics", Proc. SPIE PC13027, Energy Harvesting and Storage: Materials, Devices, and Applications XIV, PC1302703 (10 June 2024); https://doi.org/10.1117/12.3013811
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KEYWORDS
Gallium nitride
Silicon carbide
Field effect transistors
Radar
Silicon
Industrial applications
Manufacturing
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