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Yung-Ming Chang
at Industrial Technology Research Institute
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Publications (1)
Proceedings Article | 13 November 2002 Paper
Processing study of next-generation substrate
Yung-Ming Chang, Chih-Hao Chou, Hung-Yi Lin, Tung-Chuan Wu, Thomas Hsieh
Proceedings Volume 4934, (2002) https://doi.org/10.1117/12.469186
KEYWORDS: Semiconducting wafers, Wafer bonding, Silicon, Polishing, Surface finishing, Microelectromechanical systems, Oxides, Particles, Semiconductors, Radium
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