Mr. Yoshikazu Nagamura Profile

Yoshikazu Nagamura

Engineer at Renesas Technology Corp

SPIE Involvement:

Author

Proceedings Article | 19 May 2008 Paper

Verification of mask manufacturing load estimation (MiLE)

Yoshikazu Nagamura, Shogo Narukawa, Yoshiharu Shika, Hiroshi Kabashima, Aki Nakajo, Isao Miyazaki, Satoshi Aoyama, Yasutaka Morikawa, Hiroshi Mohri, Tomoko Hatada, Masahiro Kato, Hidemichi Kawase

Proceedings Volume 7028, 702837 (2008) https://doi.org/10.1117/12.793114

KEYWORDS: Photomasks, Manufacturing, Defect inspection, Metals, Optical proximity correction, Inspection, Design for manufacturing, Software development, Error analysis, Semiconductors

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Proceedings Article | 30 October 2007 Paper

Development of mask-DFM system "MiLE" load estimation of mask manufacturing

Yoshikazu Nagamura, Kunihiro Hosono, Shogo Narukawa, Hiroshi Mohri, Naoya Hayashi, Masahiro Kato, Hidemichi Kawase

Proceedings Volume 6730, 67300N (2007) https://doi.org/10.1117/12.746577

KEYWORDS: Photomasks, Manufacturing, Inspection, Defect inspection, Metals, Optical proximity correction, Semiconducting wafers, Design for manufacturing, Materials processing, Image processing

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Load of photomask manufacturing for the most advanced semiconductor devices is increasing due to the complexity of mask layouts caused by highly accurate RET or OPC, tight specification for 2D/3D mask structures, and requirements of quick deliveries. The mask cost becomes a concern of mask users especially in SoC businesses because the number of masks required throughout the wafer process is almost the same for each product regardless of the variety in production volume when a unified platform is applied to the designs. Shares of mask cost within total production cost cannot be ignored especially in small volume SoC products. DFM (design for manufacturing) is inevitable in a mask level as well as in a wafer level to solve the cost problem. "Mask-DFM" is a method to decrease the burden of mask manufacturing and to improve the yield and quality of masks, not only by modification of mask pattern layouts (design) but also all other things including utilization of designer's intents. We have developed our Mask-DFM system called "MiLE", that calculates mask-manufacturing workload through layout analyses combining information of mask configuration, and visualizes the consequence of Mask-DFM efforts. "MiLE (Mask manufacturIng Load Estimation)" calculates a relative index which represents the mask manufacturing workload determined by factors of 1) EB writing, 2) defect inspection/repair, 3) materials and processes and 4) specification. All the factors are computed before tape-outs for mask making in the system by the following methods. To estimate EB writing time, we applied high-throughput simulator and counted the number of "shot", minimum figure unit in EB writing, by using post-OPC layout data. Mask layout that caused troubles and extra load in mask inspection or repair was specified from MRC (mask rule checking) of the same post-OPC data. Additional layout analysis perceives designer's intents that are described in the layout data and these are reflected in the calculation of the "MiLE" index. Finally, chip arrangement on a mask is retrieved from so-called electronic mask spec sheets to construct mask layouts. "MiLE" notifies to designers the index of mask manufacturing workload that is caused by mask layout, while modification and adjustments of design or OPC are iterated to maximize device productivity in early design phases. Therefore, designers can judge and control the mask manufacturability, or mask cost by designs and additional intents useful for mask making. In the production phases, our system releases useful information for mask manufacturing to a mask shop and decreases the mask manufacturing workload. In this paper, we report the outline and functions of MiLE system and the results of mask manufacturing workload calculation using post-OPC layout data.

Proceedings Article | 15 May 2007 Paper

Estimation of shot counts in VSB writer using GDSII design data

Shogo Narukawa, Hiroshi Mohri, Naoya Hayashi, Yoshikazu Nagamura, Kunihiro Hosono

Proceedings Volume 6607, 66072Q (2007) https://doi.org/10.1117/12.729009

KEYWORDS: Computer aided design, Photomasks, Optical proximity correction, Manufacturing, Vestigial sideband modulation, Data conversion, Data analysis, Data processing, Computer simulations, Beam shaping

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Proceedings Article | 28 June 2005 Paper

Defect quality management of 248nm alt-PSM in low-k1 condition

Yoshikazu Nagamura, Satoshi Momose, Akira Imai, Kunihiro Hosono, Yasutaka Morikawa, Kouichirou Kojima, Hiroshi Mohri

Proceedings Volume 5853, (2005) https://doi.org/10.1117/12.617337

KEYWORDS: Chromium, Semiconducting wafers, Critical dimension metrology, Photomasks, Inspection, Lithography, Defect inspection, Phase shifts, Control systems, Bridges

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Proceedings Article | 28 August 2003 Paper

Defect printability and inspection capability for tri-tone PSM

Yoshikazu Nagamura, Kazuyuki Maetoko, Kiyoshi Maeshima, Naohisa Tamada, Kunihiro Hosono, Masaya Fujimoto, Yutaka Kodera, Koji Goto, Tsuyoshi Narita, Fuyuhiko Matsuo, Shinji Akima, Mikio Ishijima, Hironobu Iwasaki, Yasutaka Kikuchi

Proceedings Volume 5130, (2003) https://doi.org/10.1117/12.504207

KEYWORDS: Inspection, Picosecond phenomena, Chromium, Calibration, Semiconducting wafers, Defect inspection, Photomasks, Defect detection, Critical dimension metrology, Phase shifts

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Proceedings Article | 28 August 2003 Paper

New repair of clear defects on half-tone PSM using Ga implantation

Yoshikazu Nagamura, Itaru Kanai, Koji Tange, Kunihiro Hosono, Koki Hayashi, Hidehiro Ikeda, Susumu Nagashige, Mikio Ishijima, Hironobu Iwasaki, Yasutaka Kikuchi

Proceedings Volume 5130, (2003) https://doi.org/10.1117/12.504208

KEYWORDS: Carbon, Gallium, Critical dimension metrology, Semiconducting wafers, Ions, Transmittance, Ion implantation, Image processing, Photomasks, Bridges

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Proceedings Article | 28 August 2003 Paper

Photomask quality assessment strategy at 90-nm technology node with aerial image simulation

Yoshikazu Nagamura, Kunihiro Hosono, Linyong Pang, Kevin Chan, Yoshio Tanaka

Proceedings Volume 5130, (2003) https://doi.org/10.1117/12.504209

KEYWORDS: Photomasks, Semiconducting wafers, Reticles, Critical dimension metrology, Virtual reality, Image quality, Resolution enhancement technologies, Inspection, Manufacturing, Scanning electron microscopy

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Proceedings Article | 11 March 2002 Paper

Development of refined cleaning technique focusing on ecological viewpoint

Koji Tange, Yoshikazu Nagamura, Kunihiro Hosono, Yuki Oomasa, Koichi Kido, Atsushi Hayashi, Yasutaka Kikuchi, Ichiro Imagawa, Yuichi Matsuzawa, Hozumi Usui

Proceedings Volume 4562, (2002) https://doi.org/10.1117/12.458332

KEYWORDS: Particles, Transmittance, Chromium, Water, Scanning probe microscopy, Hydrogen, Photoresist processing, Excimers, Reflectivity, Optical properties

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Proceedings Article | 5 September 2001 Paper

Development of refined cleaning technique focusing on an ecological viewpoint

Koji Tange, Yoshikazu Nagamura, Kunihiro Hosono, Yuki Oomasa, Koichi Kido, Atsushi Hayashi, Yasutaka Kikuchi, Ichiro Imagawa, Yuichi Matsuzawa, Hozumi Usui

Proceedings Volume 4409, (2001) https://doi.org/10.1117/12.438375

KEYWORDS: Particles, Transmittance, Chromium, Scanning probe microscopy, Excimers, Water, Optical properties, Photoresist processing, Reflectivity, Industrial chemicals

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Proceedings Article | 1 September 1998 Paper

High-performance photomask cleaning process using electrolyzed water

Yoshikazu Nagamura, Hozumi Usui, Nobuyuki Yoshioka, H. Morimoto

Proceedings Volume 3412, (1998) https://doi.org/10.1117/12.328853

KEYWORDS: Particles, Photomasks, Quartz, Mask cleaning, Phase shifts, Ions, Transmittance, Semiconducting wafers, Halftones, Silica

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Showing 5 of 10 publications

Conference Committee Involvement (2)

Photomask and Next Generation Lithography Mask Technology XIV

17 April 2007 | Yokohama, Japan

Photomask and Next-Generation Lithography Mask Technology XIII

18 April 2006 | Yokohama, Japan

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