Superhydrophobic surfaces are the most commonly used functional surfaces. Femtosecond laser processing technology has emerged as a useful instrument for producing micro- and nanoscale structures on superhydrophobic surfaces because of its extremely high processing accuracy and highly controlled features. The substrate materials used in this work are AH36 steel plates. By varying the laser processing parameters, the microstructure shapes of steel plate surface are produced. After processing, the samples were allowed to rest in air for 30 days before characterizing their hydrophobicity. The optical and scanning electron microscopy were used to analyze its morphology, and the contact angles were measured. The study demonstrated that the surface roughness, microstructure, and hydrophobicity of AH36 steel plate samples vary with laser parameters. As a result, the AH36 steel plate exhibits the creation of a superhydrophobic surface when the contact angle reaches 151.2°, with a scanning interval of 100 μm between two lines, scanning speed of 10 mm/s, and an energy density of 3.67 J/cm². This is an important result for promoting femtosecond laser in preparing hydrophobic structures on marine metal surface.
The High Temperature Co-fired Ceramic (HTCC) substrate boasts advantages such as high structural strength, high thermal conductivity, and good chemical stability, thus showing broad application prospects in high-power microcircuits. As the circuit board material, it is necessary to use mechanical or laser drilling on the raw porcelain, and the aperture of through hole and position accuracy directly affect the yield and final electrical properties of the substrate. In recent years, laser processing technology has the advantages of high precision, high efficiency, stable performance and no contact, which increasingly become one of the most critical processes of multi-layer ceramic packaging technology. In this paper, the ultraviolet (UV) picosecond laser with pulse width of 15 ps was used for HTCC drilling with thickness of 0.14mm. The laser has a maximum power of 30W at a repetition rate of 600 kHz, a spot size of 20 μm after focusing, and a wavelength of 355nm. By optimizing the process parameters, including laser power, frequency, scanning speed, and repetitions, a minimum through-hole with diameter of 100 μm, with an accuracy of ±5 μm for entrance and exit holes were achieved. Under optical microscope, roundness, taper, and Heat-Affected Zone (HAZ) of hole under different conditions were obtained and analyzed. These results prove that ultra-fast laser processing can be an efficient HTCC drilling technique.
Owing to the exceptional physical and mechanical properties, alumina ceramics are widely applied in industrial manufacturing, where laser technology is pivotal for achieving high-precision cutting. This study investigates the laser ablation of alumina ceramics using fiber lasers, complemented by simulation to optimize processing parameters. The laser has a maximum average power of 150 W with a fiber core diameter of 25 μm. By varying laser power, frequency, and scanning speed, at an average power of 90W and a frequency of 400 Hz, the ablation efficiency and surface quality are enhanced while minimizing heat-affected zone of 50 μm. Simulation results accurately predict temperature distribution and material removal, aligning well with experimental data, thus advancing the precise machining of hard ceramics.
At present, laser cutting has emerged as a new technology in the field of glass cutting to achieve a good quality and high efficiency, that is believed to have a very broad application prospect. In this report, the glass cutting by picosecond laser with a high peak power and a long focal-depth Bessel beam was studied. The maximum power of laser is chosen to be 50 W with a spot size of 2 mm, pulse width of 10 ps, and wavelength of 1064 nm. The frequency is adjustable in the range of 50 KHz to 200 KHz. The factors affecting the cutting roughness was analyzed, including the focus position, speed, and power. Meanwhile, the glass is split by a carbon dioxide laser with the wavelength of 10.6 μm and maximum power is 100 W, which breaks due to internal stress induced by heating. By adjusting the speed, power and focusing position, the good processing parameters for the ultra-white glass with thickness of 4 mm were found. High quality cutting with minimum edge breakage less than 3 μm is confirmed by microscope. Moreover, nonstandard-shaped cutting and straight line cutting with a high speed of 300 mm/s have also achieved in this work. All results demonstrates that ultra-fast laser is a promising tool for glass cutting.
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