Tianjiao Shu
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 16 December 2022 Paper
Proceedings Volume 12501, 125011D (2022) https://doi.org/10.1117/12.2656633
KEYWORDS: Semiconducting wafers, Laser marking, Silicon, Optical character recognition, Image compression, Polishing, Pulsed laser operation, Manufacturing, Laser cutting, Technology

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