Utilizing the transparency of silicon at 2 μm, we are able to ablate the backside of 500-μm thick
silicon wafers without causing any damage to the front surface using a novel nanosecond
Tm:fiber laser system. We report on our high energy/high peak power nanosecond Tm:fiber
laser and provide an initial description of the effects of laser parameters such as pulse duration
and energy density on the ablation, and compare thresholds for front and backside machining.
The ability to selectively machine the backside of silicon wafers without disturbing the front
surface may lead to new processing techniques for advanced manufacturing in solar cell and
microelectronics industries.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.