A novel surface plasmon resonance (SPR) sensor based on differential spectral phase interferometry is introduced. Our
scheme incorporates a broadband white-light emitting diode (WLED) with double-pass Michelson interferometer for
highly sensitive Kretschmann SPR phase detection over the visible spectrum. Superior to laser based SPR interferometer
which is vulnerable to nonlinear phase saturation and conventional spectroscopic SPR sensor which only measures the
spectral intensity, the proposed spectral phase interferometer directly acquires the optimal SPR phase response of every
spectral component which is equivalent to having infinitely many SPR laser interferometers operating simultaneously at
fixed angle of incidence. Therefore the inherent phase saturation problem due to monochromatic laser source could be
readily addressed. As the result, our system prevail over existing phase detection schemes by (1) achieving comparable
ultimate detection limit as good as 10-7 refractive index unit (RIU), (2) extending the phase measurement range as far as
10-2 RIU, (3) simplifying the phase modulation scheme by directly acquiring the spectral oscillation instead of adding a
temporal carrier. Experimental verification with BSA-aBSA interaction demonstrates that our system is capable of
achieving ultimate sensitivity of 0.5ng·ml-1 (3.3pM) for ultra-sensitive aBSA detection which is among the best reported
in literature. Yet such sensitivity is extended over a wide range of measurement as each wavelength specific SPR phase
jump is monitored over the entire visible spectrum. Further biosensing application such as detection of cytochrome-c
with aptamer immobilized on the SPR sensing surface is currently under investigation. We believe that by combination
of high sensitivity, wide dynamic range and simplicity of operation, our SPR system would be truly applicable to
complicated real-life biosensing.
In the field of optical measurement, phase always represents the physical quantity to be measured. Thus, phase retrieval from a fringe pattern is a key step for quantitative measurement and evaluation. Much research work has been conducted to develop phase evaluation methods such as fringe tracking and fringe skeletons in earlier, and the more precise methods of phase-shifting and Fourier transform more recently. For phase evaluation, the phase-shifting method requires three or more phase-shifted speckle patterns at each deformed stage; thus, it is not suitable for measurement of continuous deformation. The Fourier transform, on the other hand, requires a high-frequency carrier for phase separation in the spectral domain, which places an additional requirement on experimental arrangement. Thus, it would be desirable to develop a convenient method that can retrieve the modulated phase from a single fringe pattern. We propose an approach that utilizes the phase-clustering property to extract phase information from a single interference specklegram. To explore the ability and limitation for the proposed technique, typical shearographic fringe patterns are used for phase evaluation. Results obtained are similar to those from the standard four-step phase-shifting method. Nonrepeatable continuous movement is also measured by the proposed method, and the results confirm the robustness and accuracy of the clustering method.
To reduce costs and facilitate automation in the automotive industry, adhesive bonding has gained popularity as a replacement for conventional mechanical fasteners such as bolts, screws, rivets, and welding. Adhesive bonding is particularly useful for bonding parts made of plastics and polymer composites, which are playing an increasing role in reducing vehicle weight. However, the adhesive bonding process is more susceptible to quality variations during manufacturing than traditional joining and fastening methods. Shearography and pulsed thermography are full-field, noncontact, nondestructive testing methods that are widely used in the aerospace industry, offering significant potential as practical tools for in-process inspection of adhesive bond quality. The two techniques are often used to address a common set of aerospace applications, e.g., delaminations or skin-to-core disbonds in composite structures. However, they are fundamentally different, based on different flaw detection mechanisms: Shearography measures the sample's mechanical response to mechanical stresses, while pulsed thermography measures the sample's thermal response to an instantaneous thermal excitation. For the convenience of potential users and readers, the authors review shearography and pulsed thermography. The potential of these techniques for inspecting adhesive bonding is demonstrated and compared.
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