Mr. Shinichi Shinoda Profile

Shinichi Shinoda

Researcher at Hitachi Ltd

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Author

Publications (8)

Proceedings Article | 20 March 2020 Paper

A trainable die-to-database for fast e-Beam inspection: learning normal images to detect defects

Masanori Ouchi, Masayoshi Ishikawa, Shinichi Shinoda, Yasutaka Toyoda, Ryo Yumiba, Hiroyuki Shindo, Masayuki Izawa

Proceedings Volume 11325, 113252F (2020) https://doi.org/10.1117/12.2551456

KEYWORDS: Inspection, Scanning electron microscopy, Defect detection, Image resolution, Defect inspection, Semiconducting wafers, Manufacturing, Extreme ultraviolet lithography, Semiconductors, Wafer inspection

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Proceedings Article | 26 March 2019 Paper

Deep learning's impact on pattern matching for design based metrology and design based inspection

Shuyang Dou, Shinichi Shinoda, Masayoshi Ishikawa, Ryo Yumiba, Yasutaka Toyoda, Hiroyuki Shindo, Masayuki Izawa, Masanori Ouchi

Proceedings Volume 10959, 109592G (2019) https://doi.org/10.1117/12.2514921

KEYWORDS: Scanning electron microscopy, Image processing, Metrology, Inspection, Image analysis, Lithography, 3D modeling, Image quality, Computer simulations, Device simulation

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Proceedings Article | 26 March 2019 Paper

Deep learning's impact on contour extraction for design based metrology and design based inspection

Ryo Yumiba, Masayoshi Ishikawa, Shinichi Shinoda, Shigetoshi Sakimura, Yasutaka Toyoda, Hiroyuki Shindo, Masayuki Izawa

Proceedings Volume 10959, 1095912 (2019) https://doi.org/10.1117/12.2514898

KEYWORDS: Image segmentation, Scanning electron microscopy, Image processing, Data modeling, Metrology, Surgery, Feature extraction, Shape analysis, Statistical modeling, Pattern recognition

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Proceedings Article | 25 March 2016 Paper

Focus measurement using SEM image analysis of circuit pattern

Shinichi Shinoda, Yasutaka Toyoda, Yutaka Hojo, Hitoshi Sugahara, Hiroyuki Sindo

Proceedings Volume 9778, 97783K (2016) https://doi.org/10.1117/12.2229089

KEYWORDS: Scanners, Scanning electron microscopy, Image analysis, Semiconducting wafers, Shape analysis, Semiconductors, Optical fabrication, Metrology, Process control, Critical dimension metrology

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Proceedings Article | 25 September 2010 Paper

Study of shape evaluation for mask and silicon using large field of view

Ryoichi Matsuoka, Hiroaki Mito, Shinichi Shinoda, Yasutaka Toyoda

Proceedings Volume 7823, 78232D (2010) https://doi.org/10.1117/12.867756

KEYWORDS: Photomasks, Silicon, Optical proximity correction, Semiconducting wafers, Metrology, Semiconductors, Bridges, Resolution enhancement technologies, Manufacturing, Design for manufacturing

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We have developed a highly integrated method of mask and silicon metrology. The aim of this integration is evaluating the performance of the silicon corresponding to Hotspot on a mask. It can use the mask shape of a large field, besides. The method adopts a metrology management system based on DBM (Design Based Metrology). This is the high accurate contouring created by an edge detection algorithm used in mask CD-SEM and silicon CD-SEM. Currently, as semiconductor manufacture moves towards even smaller feature size, this necessitates more aggressive optical proximity correction (OPC) to drive the super-resolution technology (RET). In other words, there is a trade-off between highly precise RET and mask manufacture, and this has a big impact on the semiconductor market that centers on the mask business. As an optimal solution to these issues, we provide a DFM solution that extracts 2-dimensional data for a more realistic and error-free simulation by reproducing accurately the contour of the actual mask, in addition to the simulation results from the mask data. On the other hand, there is roughness in the silicon form made from a mass-production line. Moreover, there is variation in the silicon form. For this reason, quantification of silicon form is important, in order to estimate the performance of a pattern. In order to quantify, the same form is equalized in two dimensions. And the method of evaluating based on the form is popular. In this study, we conducted experiments for averaging method of the pattern (Measurement Based Contouring) as two-dimensional mask and silicon evaluation technique. That is, observation of the identical position of a mask and a silicon was considered. The result proved its detection accuracy and reliability of variability on two-dimensional pattern (mask and silicon) and is adaptable to following fields of mask quality management. •Discrimination of nuisance defects for fine pattern. •Determination of two-dimensional variability of pattern. •Verification of the performance of the pattern of various kinds of Hotspots. In this report, we introduce the experimental results and the application. We expect that the mask measurement and the shape control on mask production will make a huge contribution to mask yield-enhancement and that the DFM solution for mask quality control process will become much more important technology than ever. It is very important to observe the form of the same location of Design, Mask, and Silicon in such a viewpoint. And we report it about algorithm of the image composition in Large Field.

Proceedings Article | 16 May 2003 Paper

New concept high-speed and high-resolution color scanner

Keisuke Nakashima, Shin'ichi Shinoda, Yoshiharu Konishi, Kenji Sugiyama, Tetsuya Hori

Proceedings Volume 5017, (2003) https://doi.org/10.1117/12.476744

KEYWORDS: Scanners, Cameras, Digital cameras, Sensors, Imaging systems, Digital photography, Electronic imaging, Image processing, Image resolution, Optical character recognition

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Proceedings Article | 22 October 1999 Paper

Fabrication of the ASTRO-E hard-x-ray detector

Kazuhiro Nakazawa, Tuneyoshi Kamae, Kazuo Makishima, Tadayuki Takahashi, Toshio Murakami, Makoto Tashiro, Yasushi Fukazawa, Takayuki Tamura, Naoko Iyomoto, K. Ebisawa, Y. Ezoe, M. Hamaya, M. Horii, Naoki Isobe, Motohide Kokubun, J. Kotoku, Aya Kubota, Yukari Matsumoto, Tsunefumi Mizuno, Y. Mizuno, Kunishiro Mori, Tomohisa Onishi, Naomi Ota, Shin'ichi Shinoda, Masahiko Sugiho, Koji Taguchi, I. Takahasi, Masaaki Tanaka, Chiharu Tanihata, Yukikatsu Terada, Yasunobu Uchiyama, S. Watanabe, Kazutaka Yamaoka, D. Yonetoku

Proceedings Volume 3765, (1999) https://doi.org/10.1117/12.366496

KEYWORDS: Crystals, Sensors, PIN photodiodes, Collimators, Genetical swarm optimization, Calibration, Electronics, Silicon, X-rays, Scintillation

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SPIE Journal Paper | 1 January 1992

High-quality image processing architecture for facsimiles

Keisuke Nakashima, Shin'ichi Shinoda, Yasuyuki Kojima, Yasuro Hori, Toshiaki Nakamura, Noboru Suemori

JEI, Vol. 1, Issue 01, (January 1992) https://doi.org/10.1117/12.10.1117/12.55179

KEYWORDS: Image processing, Image enhancement, Image segmentation, Diffusion, Printing, Signal processing, Halftones, Logic, Video processing, Distortion

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Showing 5 of 8 publications

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