In this paper, the bonding wire used for multi-chip interconnection is studied, and the model of non-parallel double bonding wires is proposed based on the single bonding wire model. Then, a microstrip impedance matching structure is designed based on the equivalent circuit model of non-parallel double bonding wires. In order to verify the effectiveness of microstrip impedance matching structure, experimental measurements are carried out. The experimental results show that the return loss is better than – 15dB in the frequency band of 25.8GHz - 40GHz, which is optimized by more than 5dB. The insertion loss is optimized by 0.7dB at most in the frequency band of 1GHz - 40GHz.
The multi-state rapid recognition of switches is the basic service of the AR intelligent interactive system. In order to minimize the computational burden, this article first analyzes the state characteristics of different types of switches, and introduces the advantages of HoloLens2 AR smart glasses in the recognition of the switch state. Then, according to the degree of importance, the laser point cloud scanning technology is used to generate a three-dimensional model of the equipment object and the surrounding environment that takes into account the accuracy and the amount of data. Finally, the visual SLAM algorithm technology based on the feature point method is used to complete the rapid recognition of the switch multi-state. Practical applications show that, for the switch state on the device, the recognition rate of the AR technology-based switch multi-state rapid recognition method proposed in this paper is up to 100%, which meets the needs of the AR intelligent interactive system.
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