Mr. Samuel Lytwynec Profile

Samuel Lytwynec

at Indium Corp.

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Proceedings Article | 4 March 2022 Presentation + Paper

The effect of AuSn preform thickness on thermal transfer in semiconductor laser technologies

Jenny Gallery, Samuel Lytwynec

Proceedings Volume 11983, 119830K (2022) https://doi.org/10.1117/12.2610113

KEYWORDS: Semiconductor lasers, Laser applications, X-rays, X-ray imaging, Gold, Thermal effects, Reliability, Resistance, Nanolithography, Laser welding

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For the plethora of applications that require a high-melting die-attach solder, 80Au20Sn is a great choice to ensure good performance and reliability, especially when used in one of its most highly demanded applications: semiconductor laser die-attach. However, difficulty managing thermal heat transfer has prevented the widespread use of semiconductor lasers. When the operational heat of these devices increases, their longevity and potential become limited. One option to improve thermal transfer is the use a thinner 80Au20Sn preform in the bondline, which allows the heat to transfer to the heat sink more quickly and efficiently. The creation of voiding hot spots – due to the lack of solder volume – is a perceived concern when using a thinner preform in the solder joint, which then contradicts the original intention. Voiding percentages were defined for several 80Au20Sn preform thicknesses – ranging from 0.002” to 0.00035” thick – allowing for conclusions to be drawn on the effect of 80Au20Sn preform thickness on thermal transfer in semiconductor laser technologies.

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