The growing evolution of MEMS devices over the past decade from laboratory R&D environments into volume production settings for consumer use, has required Dimensional Metrology to become an invaluable part of the device fabrication process. In this paper we examine the dimensional metrology requirements for the Inkjet MEMS, and present high precision data obtained at a variety of fabrication stages. The measurement data has been used to guide process control on these structures and ultimately has led to improved device performance.
The emergence of Micro Electro Mechanical Systems (MEMS) in production volumes has led to the need for stringent metrology. Quality control issues prompted examination of devices via analytical scanning electron microscopes (SEM); however, residues left on the resistor structures were not visible at high voltage. Thus the processes involved in the production of these devices has limited the usefulness of the traditional high voltage SEM in the measurement of critical dimensions. This paper presents the images acquired below 550 electron volts (eV) landing energy and the associated data on such inkjet devices. This capability has proven to be extremely useful both in terms of process control with metrology, and in terms of failure analysis.
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