Large area optical detection systems are required for applications including cell imaging, spectroscopy, nuclear
medicine, bio diagnostics, radiation detection and high energy physics. Each of these applications requires that a detector
or detector arrays be closely coupled with light sources or optical couplers such as fibres or light couplers. In this paper,
the scaling of novel Silicon Photomultiplier detectors to tile across a large area is presented. In particular, a novel method
is discussed for compact packaging of SPM detectors into a tiled 2D detector array for large area imaging and 2D spatial
detection. The SPM detector has performance characteristics comparable to vacuum photon multiplier tubes used in
these applications today but offers several performance and system design advantages including spatial resolution,
optical over exposure, small form factor, weight, magnetic insensitivity and low bias operation.
Article reports low loss (better than 0.09dB/cm) germano-silicate planar devices, operating at 1550nm wavelength, with optical combiner/splitters exhibiting greater splitting uniformity (~ 0.08dB) based on multimode interferences with index contrast ~ 0.7%. Excess loss of the device was improved by 0.41dB by designing output access waveguides with two S-bends operating in the Whispering-Gallery-Mode regime (WGM). The total S-bend loss was improved by inserting a straight waveguide between two cured sections, instead of two oppositely curved sections as in the conventional S-bends. This is expected to reduce transition loss about four times the transition loss between two oppositely curved sections. Optimised offsets, between waveguides of different radii, and widening of curved sections resulted in low excess loss while preserving device compactness. The separation of the output access waveguides was limited to just 250μm, for pigtailing/butt-coupling of SMF fibres, to ensure device compactness for future high-density packaging. Silica and doped-silica on silicon films were formed at low temperature, <350°C, with high deposition rates, greater than 1600 Angstroms/min, using plasma enhanced chemical vapour deposition (PECVD) technology that suits for mass production. Fabricated lightwave circuits were characterised with special care in order to avoid ambiguities that would arise from power fluctuation in the launching laser source during measurements.
Lowering optical packaging costs requires developments in new technologies. In this paper, solder ink-jet process is presented for flip-chip component assembly on planar, 3D, flex and stacked submounts and substrates. Applications for this technology are presented and include linear array in-vivo dosimeters, integrated GaN LED displays, telecomm submounts and wearable ambient systems. An important aspect of developing this technology is process reliability. In this study, the reliability of the solder to bump accurately and adhere to various target bond pads was evaluated as well as MIL standard shear tests to qualify the joint strength of the bump.
For optical networks, the operating life of optoelectronic components is expected to be over 20 years. Network designers therefore require components, which have been reliability tested in accordance with assured protocols, such as Telcordia Generic Reliability Assurance Practices (BellCore). In this paper, we report on the development of a system for thermal reliability studies of optoelectronic devices. The system incorporates an environmental test chamber programmed to provide differing temperature environments in the range (-180° to 300° C) as well as constant bias current or voltage to the device udner test. Case studies for preliminary screenign and temperature cycling tests on a wide range of novel active and passive devices fabricated at NMRC for short-haul networks markets are assessed and reported using this system.
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