The latest promising optoelectronic devices require complex 3D structures. In this study, optical grayscale microlenses and multi-height structures are etched into a polymer layer in a Capacitively Coupled Plasma reactor (CCP).
Etching can cause profile deformation and surface roughness, which may affect device performances. A parametric study is conducted to investigate 3D etching mechanisms.
We observed strong shape modulation by varying plasma parameters. Increasing chamber pressure, or decreasing High Frequency power, show similar tendencies, going from a rounded to a conic profile. Additional experiments suggest that 3D etching mechanisms rely on complex passivation processes and ion bombardment effects.
Hierarchical structures that combine microlens arrays and nanostructures exhibit exceptional potential in enhancing optical characteristics of optoelectronic devices. Furthermore, multi-scale architectures confer multifunctional capabilities to these devices. Existing methodologies for creating hierarchical structures can be classified by the initial structure fabricated: the "microfirst" and "nanofirst" approaches. Among these, the nanofirst strategy stands out as the most versatile, despite presenting challenges in 3D micropatterning on existing nanostructured surfaces. However, it leads to a greater challenge involving 3D micropatterning on existing nanostructured surfaces. To address this challenge, we propose a novel technique for fabricating hierarchical 3D microstructures through controlled bending of suspended microdisks. This method offers new perspectives on achieving hierarchical structures and 3D microstructures.
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