Mr. Kunihiro Hosono Profile

Kunihiro Hosono

at Renesas Electronics Corp

SPIE Involvement:

Author

Publications (23)

Proceedings Article | 11 May 2009 Paper

Paper

Evaluation of mask data format standard OASIS.MASK developed for mask tools

Toshio Suzuki, Yoshinori Nagaoka, Yumiko Maenaka, Venu Vellanki, Wayne Ruch, Masayoshi Mori, Keiko Hattori, Kunihiro Hosono, Shogo Narukawa, Morihisa Hoga, Hiroshi Mohri

Proceedings Volume 7379, 737931 (2009) https://doi.org/10.1117/12.824351

KEYWORDS: Data conversion, Inspection, Photomasks, Data storage servers, Standards development, Vestigial sideband modulation, Data storage, Metals, Metrology, Printing

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Proceedings Article | 17 October 2008 Paper

Paper

PMJ panel discussion overview on mask complexities, cost, and cycle time in 32-nm system LSI generation: conflict or concurrent?

Kunihiro Hosono, Kokoro Kato

Proceedings Volume 7122, 712207 (2008) https://doi.org/10.1117/12.803743

KEYWORDS: Photomasks, Inspection, Manufacturing, Design for manufacturing, Lithography, System on a chip, Optical proximity correction, Double patterning technology, Design for manufacturability, Semiconducting wafers

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Proceedings Article | 30 October 2007 Paper

Paper

Development of mask-DFM system "MiLE" load estimation of mask manufacturing

Yoshikazu Nagamura, Kunihiro Hosono, Shogo Narukawa, Hiroshi Mohri, Naoya Hayashi, Masahiro Kato, Hidemichi Kawase

Proceedings Volume 6730, 67300N (2007) https://doi.org/10.1117/12.746577

KEYWORDS: Photomasks, Manufacturing, Inspection, Defect inspection, Metals, Optical proximity correction, Semiconducting wafers, Design for manufacturing, Materials processing, Image processing

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Load of photomask manufacturing for the most advanced semiconductor devices is increasing due to the complexity of mask layouts caused by highly accurate RET or OPC, tight specification for 2D/3D mask structures, and requirements of quick deliveries. The mask cost becomes a concern of mask users especially in SoC businesses because the number of masks required throughout the wafer process is almost the same for each product regardless of the variety in production volume when a unified platform is applied to the designs. Shares of mask cost within total production cost cannot be ignored especially in small volume SoC products. DFM (design for manufacturing) is inevitable in a mask level as well as in a wafer level to solve the cost problem. "Mask-DFM" is a method to decrease the burden of mask manufacturing and to improve the yield and quality of masks, not only by modification of mask pattern layouts (design) but also all other things including utilization of designer's intents. We have developed our Mask-DFM system called "MiLE", that calculates mask-manufacturing workload through layout analyses combining information of mask configuration, and visualizes the consequence of Mask-DFM efforts. "MiLE (Mask manufacturIng Load Estimation)" calculates a relative index which represents the mask manufacturing workload determined by factors of 1) EB writing, 2) defect inspection/repair, 3) materials and processes and 4) specification. All the factors are computed before tape-outs for mask making in the system by the following methods. To estimate EB writing time, we applied high-throughput simulator and counted the number of "shot", minimum figure unit in EB writing, by using post-OPC layout data. Mask layout that caused troubles and extra load in mask inspection or repair was specified from MRC (mask rule checking) of the same post-OPC data. Additional layout analysis perceives designer's intents that are described in the layout data and these are reflected in the calculation of the "MiLE" index. Finally, chip arrangement on a mask is retrieved from so-called electronic mask spec sheets to construct mask layouts. "MiLE" notifies to designers the index of mask manufacturing workload that is caused by mask layout, while modification and adjustments of design or OPC are iterated to maximize device productivity in early design phases. Therefore, designers can judge and control the mask manufacturability, or mask cost by designs and additional intents useful for mask making. In the production phases, our system releases useful information for mask manufacturing to a mask shop and decreases the mask manufacturing workload. In this paper, we report the outline and functions of MiLE system and the results of mask manufacturing workload calculation using post-OPC layout data.

Proceedings Article | 15 May 2007 Paper

Paper

Making of P10-JOBDECK with OASIS and GDS-II fit for practical use

Masayoshi Mori, Shogo Narukawa, Kiyoshi Yamazaki, Kunihiro Hosono

Proceedings Volume 6607, 66072O (2007) https://doi.org/10.1117/12.729007

KEYWORDS: Photomasks, Binary data, Reticles, Manufacturing, Mirrors, Design for manufacturing, Data conversion, Data modeling, Product engineering, Polishing

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Recently, mask design has been becoming more complex with the increase of data volume. Therefore, it requires more functionality and portability in the mask specification and layout definition for the efficient data handling together with industry standard. SEMI-P10 order format has universal layout definition for the all sorts of mask specifications. We expect OASIS^TM (Open Artwork System Interchange Standard; SEMI standard P39) instead of conventional GDS-II to come into wide use as a more compressive stream format for 45nm node and beyond. The OASIS format is suitable for the enormous pattern file size and sub-nanometer design grid. Although SEMI-P10 is convenient to achieve all of our requirements, its complete definition is very complicated and is difficult to set up full parameters in the primary stage of mask design for production chips. In this work, we focused on minimum syntax of the chip location information from portion of SEMI-P10. And we define P10-JOBDECK as a subset of whole SEMI-P10 regulations. So, by use of P10-JOBDECK and OASIS data format, we have built up the new data handling infrastructure such as data file transfer and pattern layout viewing for the high-end mask manufacturing. In this system, the coordinates of P10-JOBDECK are described in 4X image with mirror inversion and tone reversal parameters. We use 1X coordinates in P10-JOBDECK for the pattern data files because they are the dimensions familiar to the designer, and the transformation for the mask shop is handled automatically. This style is effective for shortening the data conversion time and preventing mishandling of data. We also developed the additional viewer functions of HOTSCOPE® to confirm the pattern layout on the digital display. It is possible to add mask DFM information (design information for mask manufacturability) by the extension to the full SEMI-P10 syntax and by the use of built-in OASIS properties in the future. In this paper, we will discuss the practical application of P10-JOBDECK and the performance results of HOTSCOPE.

Proceedings Article | 15 May 2007 Paper

Paper

Estimation of shot counts in VSB writer using GDSII design data

Shogo Narukawa, Hiroshi Mohri, Naoya Hayashi, Yoshikazu Nagamura, Kunihiro Hosono

Proceedings Volume 6607, 66072Q (2007) https://doi.org/10.1117/12.729009

KEYWORDS: Computer aided design, Photomasks, Optical proximity correction, Manufacturing, Vestigial sideband modulation, Data conversion, Data analysis, Data processing, Computer simulations, Beam shaping

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Proceedings Article | 20 October 2006 Paper

Paper

A novel Alt-PSM structure: isn't this an embedded Atten-PSM?

S. Nakao, K. Hosono, S. Maejima, K. Narimatsu, T. Hanawa, K. Suko

Proceedings Volume 6349, 63492Q (2006) https://doi.org/10.1117/12.692820

KEYWORDS: Photomasks, Critical dimension metrology, Phase shifts, Image transmission, Chromium, Quartz, Printing, Logic devices, Scanning electron microscopy, Image quality

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Proceedings Article | 20 May 2006 Paper

Paper

Design for manufacturability production management activity report

Norihiko Miyazaki, T. Sato, M. Honma, N. Yoshioka, K. Hosono, T. Onodera, H. Itoh, H. Suzuki, T. Uga, K. Kadota, N. Iriki

Proceedings Volume 6283, 628302 (2006) https://doi.org/10.1117/12.681729

KEYWORDS: Design for manufacturing, Photomasks, Manufacturing, Design for manufacturability, Reticles, Standards development, Inspection, Optical proximity correction, System on a chip, Semiconductors

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Proceedings Article | 20 May 2006 Paper

Paper

Approximate method of mask flatness factor in focus deviation

Shinroku Maejima, Seiichiro Shirai, Akira Imai, Shuji Nakao, Koji Tange, Akira Chiba, Kunihiro Hosono, Koichiro Narimatsu

Proceedings Volume 6283, 62833A (2006) https://doi.org/10.1117/12.681829

KEYWORDS: Photomasks, Interferometers, Scanners, Semiconducting wafers, Monochromatic aberrations, Integrated circuits, Manufacturing, Critical dimension metrology, Overlay metrology, Inspection

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Proceedings Article | 28 June 2005 Paper

Paper

Requirements for mask technology from the view point of SOC and FLASH memory trends

Akira Imai, Noboyuki Yoshioka, Tetsuro Hanawa, Koichiro Narimatsu, Kunihiro Hosono, Kazuyuki Suko

Proceedings Volume 5853, (2005) https://doi.org/10.1117/12.617033

KEYWORDS: Photomasks, Design for manufacturing, Lithography, Semiconductors, System on a chip, Maskless lithography, Optical proximity correction, Semiconducting wafers, Polarization, Design for manufacturability

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Proceedings Article | 28 June 2005 Paper

Paper

Defect quality management of 248nm alt-PSM in low-k1 condition

Yoshikazu Nagamura, Satoshi Momose, Akira Imai, Kunihiro Hosono, Yasutaka Morikawa, Kouichirou Kojima, Hiroshi Mohri

Proceedings Volume 5853, (2005) https://doi.org/10.1117/12.617337

KEYWORDS: Chromium, Semiconducting wafers, Critical dimension metrology, Photomasks, Inspection, Lithography, Defect inspection, Phase shifts, Control systems, Bridges

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Proceedings Article | 6 December 2004 Paper

Paper

R-mask: a new concept and its application for small-volume production

Katsuya Hayano, Shoji Hotta, Norio Hasegawa, Kunihiro Hosono, Toshihiko Tanaka, Kazuyuki Suko, Shiho Sasaki, Hiroshi Mohri, Morihisa Hoga, Naoya Hayashi

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.572200

KEYWORDS: Photomasks, Chromium, Semiconducting wafers, Inspection, Defect inspection, Logic devices, Photography, Scanning electron microscopy, Critical dimension metrology, Manufacturing

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Proceedings Article | 6 December 2004 Paper

Paper

R-mask: simple and low-cost fabrication techniques

Akiko Fujii, Shiho Sasaki, Mochihiro Shimizu, Yukie Kobayashi, Takashi Tominaga, Morihisa Hoga, Hiroshi Mohri, Naoya Hayashi, Katsuya Hayano, Norio Hasegawa, Kunihiro Hosono, Tadashi Arai

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.572191

KEYWORDS: Photomasks, Inspection, Manufacturing, Quartz, Semiconducting wafers, Photoresist processing, Absorbance, Fabrication, Defect inspection, Pellicles

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Proceedings Article | 20 August 2004 Paper

Paper

Progressive architecture of mask supply chain and integrated operation system supporting extreme-QTAT device manufacturing

Masayoshi Mori, Isao Miyazaki, Ken Fujimoto, Kunihiro Hosono

Proceedings Volume 5446, (2004) https://doi.org/10.1117/12.557724

KEYWORDS: Photomasks, Manufacturing, System integration, Semiconducting wafers, Integration, Control systems, Mask making, Interfaces, Optical proximity correction, Inspection

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Proceedings Article | 28 August 2003 Paper

Paper

New repair of clear defects on half-tone PSM using Ga implantation

Yoshikazu Nagamura, Itaru Kanai, Koji Tange, Kunihiro Hosono, Koki Hayashi, Hidehiro Ikeda, Susumu Nagashige, Mikio Ishijima, Hironobu Iwasaki, Yasutaka Kikuchi

Proceedings Volume 5130, (2003) https://doi.org/10.1117/12.504208

KEYWORDS: Carbon, Gallium, Critical dimension metrology, Semiconducting wafers, Ions, Transmittance, Ion implantation, Image processing, Photomasks, Bridges

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Proceedings Article | 28 August 2003 Paper

Paper

Improvement of critical dimension stability of chemically amplified resist by overcoat II

Teruhiko Kumada, Koji Tange, Kazuyuki Maetoko, Kunihiro Hosono, Masayoshi Tsuzuki, Kyoichi Yonetani, Reiji Terada, Yukio Nakashiba, Shingo Anzai, Yasutaka Kikuchi

Proceedings Volume 5130, (2003) https://doi.org/10.1117/12.504182

KEYWORDS: Critical dimension metrology, Photomasks, Chemically amplified resists, Manufacturing, Polymers, Photoresist processing, Coating, Diffusion, Semiconducting wafers, Molecules

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Proceedings Article | 28 August 2003 Paper

Paper

Photomask quality assessment strategy at 90-nm technology node with aerial image simulation

Yoshikazu Nagamura, Kunihiro Hosono, Linyong Pang, Kevin Chan, Yoshio Tanaka

Proceedings Volume 5130, (2003) https://doi.org/10.1117/12.504209

KEYWORDS: Photomasks, Semiconducting wafers, Reticles, Critical dimension metrology, Virtual reality, Image quality, Resolution enhancement technologies, Inspection, Manufacturing, Scanning electron microscopy

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Proceedings Article | 28 August 2003 Paper

Paper

Defect printability and inspection capability for tri-tone PSM

Yoshikazu Nagamura, Kazuyuki Maetoko, Kiyoshi Maeshima, Naohisa Tamada, Kunihiro Hosono, Masaya Fujimoto, Yutaka Kodera, Koji Goto, Tsuyoshi Narita, Fuyuhiko Matsuo, Shinji Akima, Mikio Ishijima, Hironobu Iwasaki, Yasutaka Kikuchi

Proceedings Volume 5130, (2003) https://doi.org/10.1117/12.504207

KEYWORDS: Inspection, Picosecond phenomena, Chromium, Calibration, Semiconducting wafers, Defect inspection, Photomasks, Defect detection, Critical dimension metrology, Phase shifts

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Proceedings Article | 1 August 2002 Paper

Paper

Improvement of critical dimension stability of chemically amplified resist by overcoat

Teruhiko Kumada, Atsuko Sasahara, Kazuyuki Maetoko, Kunihiro Hosono, Takemichi Honma, Yuji Kodaira, Yukio Nakashiba, Masaoshi Tsuzuki, Yasutaka Kikuchi

Proceedings Volume 4754, (2002) https://doi.org/10.1117/12.476955

KEYWORDS: Critical dimension metrology, Photomasks, Chemically amplified resists, Manufacturing, Photoresist processing, Polymers, Inspection, Coating, Printing, Diffusion

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Proceedings Article | 11 March 2002 Paper

Paper

Development of refined cleaning technique focusing on ecological viewpoint

Koji Tange, Yoshikazu Nagamura, Kunihiro Hosono, Yuki Oomasa, Koichi Kido, Atsushi Hayashi, Yasutaka Kikuchi, Ichiro Imagawa, Yuichi Matsuzawa, Hozumi Usui

Proceedings Volume 4562, (2002) https://doi.org/10.1117/12.458332

KEYWORDS: Particles, Transmittance, Chromium, Water, Scanning probe microscopy, Hydrogen, Photoresist processing, Excimers, Reflectivity, Optical properties

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Proceedings Article | 5 September 2001 Paper

Paper

Development of refined cleaning technique focusing on an ecological viewpoint

Koji Tange, Yoshikazu Nagamura, Kunihiro Hosono, Yuki Oomasa, Koichi Kido, Atsushi Hayashi, Yasutaka Kikuchi, Ichiro Imagawa, Yuichi Matsuzawa, Hozumi Usui

Proceedings Volume 4409, (2001) https://doi.org/10.1117/12.438375

KEYWORDS: Particles, Transmittance, Chromium, Scanning probe microscopy, Excimers, Water, Optical properties, Photoresist processing, Reflectivity, Industrial chemicals

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Proceedings Article | 17 May 1994 Paper

Paper

Attenuated phase-shifting mask with a single-layer absorptive shifter of CrO, CrON, MoSiO, and MoSiON film

Masayuki Nakajima, Nobuyuki Yoshioka, Junji Miyazaki, Haruhiko Kusunose, Kunihiro Hosono, Hiroaki Morimoto, Wataru Wakamiya, Keiichi Murayama, Yaichiro Watakabe, Katsuhiro Tsukamoto

Proceedings Volume 2197, (1994) https://doi.org/10.1117/12.175405

KEYWORDS: Photomasks, Phase shifts, Lithography, Etching, Transmittance, Excimer lasers, Semiconducting wafers, Sputter deposition, Mask making, Molybdenum

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Proceedings Article | 1 June 1992 Paper

Paper

Novel process for phase-shifting mask fabrication

Haruhiko Kusunose, Satoshi Aoyama, Kunihiro Hosono, Susumu Takeuchi, Shuichi Matsuda, Maaike Op de Beeck, Nobuyuki Yoshioka, Yaichiro Watakabe

Proceedings Volume 1674, (1992) https://doi.org/10.1117/12.130323

KEYWORDS: Phase shifts, Chromium, Photomasks, Etching, Mask making, Ultraviolet radiation, Metals, Quartz, Inspection, Floods

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Proceedings Article | 1 June 1992 Paper

Paper

Novel architecture for high-speed dual-image generation of pattern data for phase-shifting reticle inspection

Kunihiro Hosono, Susumu Takeuchi, Yaichiro Watakabe, Tim Wihl, Mark Brandemuehl, David Joseph

Proceedings Volume 1673, (1992) https://doi.org/10.1117/12.59796

KEYWORDS: Inspection, Data conversion, Reticles, Phase shifts, Image resolution, Databases, Phase shifting, Image processing, Manufacturing, Integrated circuits

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Showing 5 of 23 publications

Proceedings Volume Editor (2)

SPIE Conference Volume | 24 May 2010

Photomask and Next-Generation Lithography Mask Technology XVII

SPIE Conference Volume | 8 May 2009

Photomask and Next-Generation Lithography Mask Technology XVI

Conference Committee Involvement (8)

Photomask Japan 2010

13 April 2010 | Yokohama, Japan

Photomask and NGL Mask Technology

8 April 2009 | Yokohama, Japan

Photomask and Next Generation Lithography Mask Technology XIV

17 April 2007 | Yokohama, Japan

Photomask and Next-Generation Lithography Mask Technology XIII

18 April 2006 | Yokohama, Japan

Photomask and Next-Generation Lithography Mask Technology XII

13 April 2005 | Yokohama, Japan

Showing 5 of 8 Conference Committees

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