An accurate modeling of the current conduction through the gate stack is needed to identify the residual conduction paths, to improve the behavior of the device in future iterations of the technological process. Models available in the literature are applied to the study of experimental gate leakage measurements in gallium oxide MOSFETs in a wide temperature range, from cryogenic temperature up to 350 K. Experimental results show a dominant Poole-Frenkel mechanism at high temperature and high bias, and Fowler-Nordheim tunneling at low temperature. A suitable rate equation was developed to model the time-dependent behavior of the gate leakage with applied bias. The gate leakage model was implemented in TCAD, and is able to reproduce the experimental behavior from the milliseconds to the hundreds of seconds range.
In this paper we analyze the conduction properties, charge trapping and threshold voltage instability of normally-on β-Ga2O3 lateral MOSFETs for high power applications by means of threshold voltage transients. We found that a positive bias applied to the gate induces a rightward shift in the threshold voltage, caused by the trapping of electrons at border traps close to the semiconductor-dielectric interface.
The amount of trapped charge was investigated by an innovative fast-CV experimental setup and was found to follow a logarithmic kinetic in time, modeled by a generalization of the inhibition model that takes into account the effect of columbic repulsion in stress conditions.
Then, we developed a model for the gate conduction based on temperature dependent IG-VG characteristics. We detected that the gate current characterized in temperature and bias conditions similar to the ones used for the stress is dominated by Poole-Frenkel conduction assisted by a deep level at EC - 0.12 eV.
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