Mr. Koichi Yatsuda Profile

Koichi Yatsuda

Group Leader at TEL

SPIE Involvement:

Author

Publications (10)

Proceedings Article | 20 March 2015 Paper

Driving DSA into volume manufacturing

Mark Somervell, Takashi Yamauchi, Soichiro Okada, Tadatoshi Tomita, Takanori Nishi, Shinichiro Kawakami, Makoto Muramatsu, Etsuo Iijima, Vinayak Rastogi, Takeo Nakano, Fumiko Iwao, Seiji Nagahara, Hiroyuki Iwaki, Makiko Dojun, Koichi Yatsuda, Toshikatsu Tobana, Ainhoa Romo Negreira, Doni Parnell, Benjamen Rathsack, Kathleen Nafus, Jean-Luc Peyre, Takahiro Kitano

Proceedings Volume 9425, 94250Q (2015) https://doi.org/10.1117/12.2085776

KEYWORDS: Etching, Semiconducting wafers, Optical lithography, Polymethylmethacrylate, Line edge roughness, Manufacturing, Image processing, Ecosystems, Line width roughness, Directed self assembly

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Proceedings Article | 27 March 2014 Paper

High-volume manufacturing equipment and processing for directed self-assembly applications

Mark Somervell, Takashi Yamauchi, Soichiro Okada, Tadatoshi Tomita, Takanori Nishi, Etsuo Iijima, Takeo Nakano, Takumi Ishiguro, Seiji Nagahara, Hiroyuki Iwaki, Makiko Dojun, Mariko Ozawa, Koichi Yatsuda, Toshikatsu Tobana, Ainhoa Romo Negreira, Doni Parnell, Shinchiro Kawakami, Makoto Muramatsu, Benjamen Rathsack, Kathleen Nafus, Jean-Luc Peyre, Takahiro Kitano

Proceedings Volume 9051, 90510N (2014) https://doi.org/10.1117/12.2045975

KEYWORDS: Semiconducting wafers, Etching, Polymethylmethacrylate, Thin film coatings, High volume manufacturing, Ecosystems, Lithography, Manufacturing, Manufacturing equipment, Directed self assembly

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Proceedings Article | 29 March 2013 Paper

STT MRAM patterning challenges

Werner Boullart, Dunja Radisic , Vasile Paraschiv, Sven Cornelissen, Mauricio Manfrini, Koichi Yatsuda, Eiichi Nishimura, Tetsuya Ohishi, Shigeru Tahara

Proceedings Volume 8685, 86850F (2013) https://doi.org/10.1117/12.2013602

KEYWORDS: Etching, Plasma, Plasma etching, Optical lithography, Ions, Wet etching, Ion beams, Magnetism, Chemistry, Tantalum

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Proceedings Article | 29 March 2013 Paper

Advances in directed self assembly integration and manufacturability at 300 mm

Benjamen Rathsack, Mark Somervell, Makato Muramatsu, Keiji Tanouchi, Takahiro Kitano, Eiichi Nishimura, Koichi Yatsuda, Seiji Nagahara, Hiroyuki Iwaki, Keiji Akai, Mariko Ozawa, Ainhoa Romo Negreira, Shigeru Tahara, Kathleen Nafus

Proceedings Volume 8682, 86820K (2013) https://doi.org/10.1117/12.2012018

KEYWORDS: Etching, Polymethylmethacrylate, Manufacturing, Picosecond phenomena, Ecosystems, Semiconducting wafers, Inspection, Directed self assembly, Materials processing, Polymers

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Proceedings Article | 21 March 2012 Paper

Pattern scaling with directed self assembly through lithography and etch process integration

Benjamen Rathsack, Mark Somervell, Josh Hooge, Makoto Muramatsu, Keiji Tanouchi, Takahiro Kitano, Eiichi Nishimura, Koichi Yatsuda, Seiji Nagahara, Iwaki Hiroyuki, Keiji Akai, Takashi Hayakawa

Proceedings Volume 8323, 83230B (2012) https://doi.org/10.1117/12.916311

KEYWORDS: Etching, Semiconducting wafers, Line edge roughness, Picosecond phenomena, Lithography, Polymers, Polymethylmethacrylate, Chemical analysis, Silicon, Directed self assembly

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Proceedings Article | 17 March 2012 Paper

Exploration of suitable dry etch technologies for directed self-assembly

Fumiko Yamashita, Eiichi Nishimura, Koichi Yatsuda, Hiromasa Mochiki, Julie Bannister

Proceedings Volume 8328, 83280T (2012) https://doi.org/10.1117/12.916349

KEYWORDS: Etching, Ions, Picosecond phenomena, Polymethylmethacrylate, Plasma, Chemistry, Dry etching, Polymers, Line edge roughness, Directed self assembly

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Proceedings Article | 17 March 2012 Paper

EUV resist curing technique for LWR reduction and etch selectivity enhancement

Kazuki Narishige, Takayuki Katsunuma, Masanobu Honda, Koichi Yatsuda

Proceedings Volume 8328, 83280N (2012) https://doi.org/10.1117/12.916340

KEYWORDS: Extreme ultraviolet, Etching, Line width roughness, Photoresist processing, Plasma, Silicon, Electrodes, Photoresist materials, Polymers, Ions

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Proceedings Article | 16 March 2012 Paper

Patterning enhancement techniques by reactive ion etch

Masanobu Honda, Koichi Yatsuda

Proceedings Volume 8328, 832809 (2012) https://doi.org/10.1117/12.920309

KEYWORDS: Reactive ion etching, Critical dimension metrology, Plasma, Etching, Polymers, Tolerancing, Sulfur, Plasma etching, Carbon monoxide, Image processing

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Proceedings Article | 7 March 2008 Paper

Fabrication of contact/via holes for 32-nm technology device using cost-effective RIE CD shrink process and double patterning technique

Masato Kushibiki, Eiichi Nishimura, Koichi Yatsuda

Proceedings Volume 6924, 692426 (2008) https://doi.org/10.1117/12.772669

KEYWORDS: Reactive ion etching, Critical dimension metrology, Photomasks, Lithography, Double patterning technology, Chemical vapor deposition, Photoresist processing, Etching, Polymers, Fabrication

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Proceedings Article | 7 March 2008 Paper

Precise CD control techniques for double patterning and sidewall transfer

Eiichi Nishimura, Masato Kushibiki, Koichi Yatsuda

Proceedings Volume 6924, 692425 (2008) https://doi.org/10.1117/12.772630

KEYWORDS: Etching, Photomasks, Wet etching, Dry etching, Reactive ion etching, Critical dimension metrology, Silicon, Double patterning technology, Silicon films, Oxides

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Showing 5 of 10 publications

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