The characterization of SiGe diode-connected heterojunction bipolar transistors (HBTs) through measurements of two-circuit configurations is presented. Characterization is done to understand the behavior of these diodes for near-infrared detecting applications at room temperature and 77 K. The two configurations that are considered differ; the first is a base-emitter shorted HBT and the second is a base-collector shorted HBT. The parameters measured are current density-voltage, capacitance–voltage, and noise. The two configurations are implemented using the austriamicrosystems AG 0.35-μm process. The base-emitter shorted configuration exhibits a flatter JC versus V curve when in reverse bias compared with the base-collector configuration. The C − V curves are the same for both configurations. The noise voltage of the base-emitter configuration is 36 and 14.48 μV / Hz at 102.5 Hz for 293 and 77 K temperature points, respectively, to 14.48 and 12.42 μV / Hz at 50 kHz for 293 and 77 K, respectively. The noise voltage for the base-collector configuration is 12.6 and 7.56 μV / Hz at 102.5 Hz for 293 and 77 K, respectively, to 2.228 and 5.981 μV / Hz at 50 kHz for 293 and 77 K, respectively. This work is done using a standard Si-based technology, where a detector array with readout circuitry can be prototyped as a single chip. The floating base transistor topology is analyzed and used as a foundation for this work. The characteristics of a floating base configuration result in a wide depletion region, large-series resistance, and small-series capacitance. When shorting the base with the emitter and collector, respectively, compared with a floating base configuration, a smaller depletion region, reduced series resistance, and larger series capacitance are observed.
In this work, the frequency response of a single-element, direct band gap indium gallium arsenide (In0.53Ga0.47As)
infrared photo-detector on a lattice matched indium phosphide (InP) substrate is investigated by varying the intrinsic
layer doping concentration. The intrinsic device operation and transport physics are theoretically determined and
simulated. The epitaxial layer structure, physical dimensions, doping profiles and carrier concentrations are modelled for
a complete PIN photodetector with cut-off wavelength of 1680 nm at 295 K. The calculated and simulated device
performance parameters are based on the responsivity, quantum efficiency, dark-current in reverse-biased operation,
frequency bandwidth and intrinsic junction capacitance. These parameters are also measured and the frequency response
is determined by a low-power 1064 nm neodymium-doped yttrium aluminium garnet (Nd:YAG) pulsed laser at the
output of a high-gain transimpedance amplifier. The shortest measurable pulse rise-time for this configuration is 12.4 ns.
The dark-current, frequency response and intrinsic junction capacitance results are used to represent the equivalent
circuit model of the photodetector at the input of the transimpedance amplifier. The primary goal is to identify the
variations in performance based on the intrinsic layer composition, manufacturing considerations and epitaxial
enhancements to improve the bandwidth of such a device.
Silicon-germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS) transistors have vertical doping profiles reaching deeper into the substrate when compared to lateral CMOS transistors. Apart from benefiting from high-speed, high current gain and low-output resistance due to its vertical profile, BiCMOS technology is increasingly becoming a preferred technology for researchers to realise next-generation space-based optoelectronic applications. BiCMOS transistors have inherent radiation hardening, to an extent predictable cryogenic performance and monolithic integration potential.
SiGe BiCMOS transistors and p-n junction diodes have been researched and used as a primary active component for over the last two decades. However, further research can be conducted with diode-connected heterojunction bipolar transistors (HBTs) operating at cryogenic temperatures. This work investigates these characteristics and models devices by adapting standard fabrication technology components.
This work focuses on measurements of the current-voltage relationship (I-V curves) and capacitance-voltage relationships (C-V curves) of diode-connected HBTs. One configuration is proposed and measured, which is emitterbase shorted. The I-V curves are measured for various temperature points ranging from room temperature (300 K) to the temperature of liquid nitrogen (77 K). The measured datasets are used to extract a model of the formed diode operating at cryogenic temperatures and used as a standard library component in computer aided software designs.
The advantage of having broad-range temperature models of SiGe transistors becomes apparent when considering implementation of application-specific integrated circuits and silicon-based infrared radiation photodetectors on a single wafer, thus shortening interconnects and lowering parasitic interference, decreasing the overall die size and improving on overall cost-effectiveness. Primary applications include space-based geothermal radiation sensing and cryogenic terahertz radiation sensing.
This work aims to provide an analysis on the material properties, layer geometries, design, and fabrication of a singleelement, direct band gap indium gallium arsenide (InxGa1-xAs) infrared photo-detector on a lattice matched indium phosphide (InP) substrate with cut-off wavelength of 1700 nm. A theoretical study on the mechanisms present during device operation allows accurate modelling and simulation on the intrinsic behaviour and transport physics to provide reasoning behind material type, carrier concentrations and doping profiles, and the proposed physical dimensions. The estimated device performance based on the responsivity and quantum efficiency, dark current, bandwidth, and intrinsic junction capacitance is also presented. Device optimization through silicon nitride (SiNx) anti-reflection and silicon dioxide (SiO2) passivation layer combinations is investigated based on light reflection and diffraction minimization. Finally, an equivalent electrical circuit representation of the dominant noise sources in light and dark conditions aims to provide additional insight into device optimization.
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