Femtosecond lasers has the ability to cleanly cut a wide variety of materials with minimal effect to the surrounding material. Also, the availability of high-power industrial femtosecond lasers made it possible to achieve high throughputs, which is critical for high volume manufacturing. In this work, we investigate the benefits of using high-power IR femtosecond lasers in processing: separator foil and anode/cathode material used in Li-ion battery manufacturing, polycrystalline diamond (PCD), polypropylene (PP), high density polyethylene (HDPE) and silicon carbide (SiC). Our studies demonstrate that using a high-power IR femtosecond laser for processing these materials results in high throughputs with acceptable HAZ (heat-affected zone) meeting the demands of the industry.
The accelerated adoption of e-mobility is causing rapid and large-scale changes in power electronics manufacturing. The circuitry for the advanced electronic drive systems must tolerate high voltages, high currents, and decreasing switching times. All of this requires a migration from silicon-substrate based devices to those built on silicon carbide (SiC) crystal substrates. In this work, we present ablation study results using high power ultrashort pulse (USP) lasers for processing crystalline 4H-type crystalline SiC wafers. Ablation thresholds and material removal efficiencies are characterized, and the advantages of using tailored burst output for machining high-quality features is demonstrated.
The use of lasers for Printed Circuit Board (PCB) manufacturing continues to grow as their cost-per-Watt goes down and power levels go up. Furthermore, many lasers now offer features such as temporal pulse tailoring, which is often beneficial. In this work, we demonstrate several PCB processes using UV and green high-power ns-pulse lasers. In addition to cutting thicker FR4, cutting of system in package (SiP) material is demonstrated, and a process using advanced temporal pulse tailoring with 100 W of UV single-mode laser power for percussion flex-PCB via-drilling is demonstrated for a ~50 μm hole diameter.
The ability to cut heat-sensitive polymers with minimum kerf width and low HAZ, and at high speeds, is critical for many industrial applications. In this work, we investigate the benefits of using high-power femtosecond UV lasers in processing polymer materials, which are commonly used for OLED displays and flexible circuit boards manufacturing. In particular, we present a study on the impact of the processing conditions on the throughput and quality of laser cutting of polyimide (PI), polyethylene terephthalate (PET) and polytetrafluoroethylene (PTFE) polymers as well as OLED display multi-layer polymer film stacks.
A relatively new consumer electronics market is active eyewear, which includes virtual reality (VR) and augmented reality (AR) glasses. AR glasses present the challenge of combining the functionality of conventional eyeglasses with that of projected graphics, leading to the use of glasses with higher than typical indices of refraction. Infrared (IR) picosecond pulse lasers are commonly used for cutting conventional glasses. We present results using a 50 W IR picosecond laser to cut high-index glass for AR eyewear applications, demonstrating excellent quality at with high throughput. Straight line as well as curved contour cutting are demonstrated.
Several fields, such as consumer electronics manufacturing, medical device packaging and microfluidics have motivated the development of techniques for adhesiveless bonding of glasses both to other glasses, and to dissimilar materials, such as metals. With the use of ultrafast lasers, through-transmission welding can be achieved using a transparent wavelength to focus tightly at the interface of the materials to be bonded. The combination of absorption initiated by high intensities near the focal point and high pulse repetition frequencies induces heat accumulation. This leads to localized melting and joining of the two materials. Other currently available laser-based methods require introduction of additional material to serve as an absorbing media at the interface to couple energy to the materials and initiate welding. Conversely ultrafast lasers benefit from their inherent ability to induce non-linear absorption localized at the focus. This allows for the potential to develop efficient microwelds that do not age, and require no intermediate layer, preserving transparency in the case of glass-to-glass welding. In this work, we present results for glass-to-glass and glass-to-metal microwelding using a high repetition rate picosecond pulsed laser. Linear joining speeds of 10’s to 100’s of mm/s are demonstrated and their geometries characterized. Welds are evaluated qualitatively by optical inspection through the glass and inspection of prepared cross-sections.
High volume manufacturing of flat panel displays presents many challenges to realize precision features over large panel sizes with high yield and high throughput. Laser technology continues to be a key enabler in many respects. In particular, for cutting display glass plates, ultrafast lasers with pulse durations in the picosecond and femtosecond regime offer unique advantages. Processing display cover glass, which is highly transparent to both visible and UV wavelengths, can benefit from ultrashort laser pulses which deposit a high amount of energy in very short time scales. This allows for fine structuring of the glass with minimal chipping, cracking, and melting. In this work, we present display glass cutting results using state-of-the art, novel picosecond pulse laser technology. High quality and high throughput results are demonstrated, with precise glass cutting achieved with low sidewall roughness at speeds in the 1 m/s regime.
Ceramic materials are used extensively in the microelectronics, semiconductor, and LED lighting industries because of their electrically insulating and thermally conductive properties, as well as for their high-temperature-service capabilities. However, their brittleness presents significant challenges for conventional machining processes. In this paper we report on a series of experiments that demonstrate and characterize the efficacy of pulsed nanosecond UV and green lasers in machining ceramics commonly used in microelectronics manufacturing, such as aluminum oxide (alumina) and aluminum nitride. With a series of laser pocket milling experiments, fundamental volume ablation rate and ablation efficiency data were generated. In addition, techniques for various industrial machining processes, such as shallow scribing and deep scribing, were developed and demonstrated. We demonstrate that lasers with higher average powers offer higher processing rates with the one exception of deep scribes in aluminum nitride, where a lower average power but higher pulse energy source outperformed a higher average power laser.
The application of thin borosilicate glass as interposer material requires methods for separation and drilling of this material. Laser processing with short and ultra-short laser pulses have proven to enable high quality cuts by either direct ablation or internal glass modification and cleavage. A recently developed high power UV nanosecond laser source allows for pulse shaping of individual laser pulses. Thus, the pulse duration, pulse bursts and the repetition rate can be set individually at a maximum output power of up to 60 W. This opens a completely new process window, which could not be entered with conventional Q-switched pulsed laser sources. In this study, the novel pulsed UV laser system was used to study the laser ablation process on 400 μm thin borosilicate glass at different pulse durations ranging from 2 – 10 ns and a pulse burst with two 10 ns laser pulses with a separation of 10 ns. Single line scan experiments were performed to correlate the process parameters and the laser pulse shape with the ablation depth and cutting edge chipping. Increasing the pulse duration within the single pulse experiments from 2 ns to longer pulse durations led to a moderate increase in ablation depth and a significant increase in chipping. The highest material removal was achieved with the 2x10 ns pulse burst. Experimental data also suggest that chipping could be reduced, while maintaining a high ablation depth by selecting an adequate pulse overlap. We also demonstrate that real-time combination of different pulse patterns during drilling a thin borosilicate glass produced holes with low overall chipping at a high throughput rate.
Increasing demand for creating fine features with high accuracy in manufacturing of electronic mobile devices has fueled growth for lasers in manufacturing. High power, high repetition rate ultraviolet (UV) lasers provide an opportunity to implement a cost effective high quality, high throughput micromachining process in a 24/7 manufacturing environment. The energy available per pulse and the pulse repetition frequency (PRF) of diode pumped solid state (DPSS) nanosecond UV lasers have increased steadily over the years. Efficient use of the available energy from a laser is important to generate accurate fine features at a high speed with high quality. To achieve maximum material removal and minimal thermal damage for any laser micromachining application, use of the optimal process parameters including energy density or fluence (J/cm2), pulse width, and repetition rate is important. In this study we present a new high power, high PRF QuasarR 355-40 laser from Spectra-Physics with TimeShiftTM technology for unique software adjustable pulse width, pulse splitting, and pulse shaping capabilities. The benefits of these features for micromachining include improved throughput and quality. Specific example and results of silicon scribing are described to demonstrate the processing benefits of the Quasar’s available power, PRF, and TimeShift technology.
Due to current and future anticipated widespread use of thin silicon wafers in the microelectronics industry, there is a
large and growing interest in laser-based wafer dicing solutions. As the wafers become thinner, the laser advantage over
saw dicing increases in terms of both the speed and yield of the process. Furthermore, managing the laser heat input
during the dicing process becomes more important with increasingly thin wafers and with increasingly narrow saw
streets. In this work, shaped-beam laser-cutting of thin (100 μm and below) silicon is explored with Newport / Spectra-
Physics Pulseo 20-W nanosecond-pulse 355-nm DPSS q-switched laser system. Optimal process conditions for
cutting various depths in silicon are determined, with particular emphasis on fluence optimization for a narrow-kerf
cutting process. By shaping the laser beam into a line focus, the optimal fluence for machining the silicon can be
achieved while at the same time utilizing the full output power of the laser source. In addition, by adjusting the length of
the laser line focus, the absolute fastest speed for various cutting depths is realized. Compared to a circular beam, a
dramatic improvement in process efficiency is observed.
KEYWORDS: Amorphous silicon, Thin films, Glasses, Thin film solar cells, Pulsed laser operation, Laser damage threshold, Photovoltaics, Solar energy, Solar cells, Thin film devices
The removal of thin films widely used in photovoltaics as (transparent) electrodes (e.g. SnO2, molybdenum) or solar
absorber (e.g. amorphous silicon) materials is studied experimentally using multi-kHz diode-pumped solid state lasers in
the visible and infrared spectral region. The film processing (or what is commonly known as P1, P2, or P3 laser scribing)
is performed through the film-supporting glass plate of several millimeter thickness by using a galvo laser scanner setup
equipped with f-theta optics. The dependence of the film removal fluence threshold on the laser pulse duration (~8 ns to
~40 ns) is investigated systematically for two different laser wavelengths of 532 nm and 1064 nm. The laser-scribing of
continuous lines suitable for thin-film solar cell production is demonstrated successfully at scribe speeds on the order of
meters per second. The experimental results are discussed on the basis of laser ablation models considering optical,
geometrical, and thermal material properties and are additionally supported by numerical simulations.
It has been shown that micromachining of polymer materials using mode-locked, high repetition rate, 355nm picosecond
lasers is more efficient in respect to ablation rates and processing speeds, than using q-switched lasers at the same
wavelength and same average power level. In this study we present a systematic comparison of application results
obtained with q-switched nanosecond and mode-locked picosecond ultraviolet (UV) lasers. From the results, guidelines
are derived as to which laser type to use for best results depending upon material type and thickness. Additionally, recent
results obtained using a high power mode-locked UV picosecond laser - the PanteraTM - are described, along with
implications of how scaled-up power can significantly enhance processing efficiency in manufacturing environments.
We have systematically studied femtosecond-laser fabrication of optical waveguides in an Er-Yb doped phosphate glass.
Waveguides were written using the IMRA America FCPA μJewel D-400 femtosecond fiber laser system with pulse
repetition rates ranging from 250 kHz to 2.2 MHz. At every pulse repetition rate a series of waveguides was written
while varying scan speeds from 50 μm/s to 100 mm/s and pulse energies from 80 nJ to 320 nJ. The optical quality of the
waveguides was evaluated by measuring the waveguide mode profile as well as the optical loss. Laser-induced defects
and structural changes in the glass were characterized using confocal fluorescence and Raman microscopy.
It has been shown that micromachining of polyimide using a mode-locked high repetition rate, 80 MHz, 355nm laser is more efficient than the q-switched laser at same wavelength and same power level in terms of material removal rate. In this study we have explored and characterized the benefits of using high repetition rate, high average power, 355 nm mode-locked and q-switched lasers for micromachining of various microelectronics packaging materials that have different thermal properties. The removal rate and quality of machining have been analyzed against the difference in thermal properties of the material. The implications of the results observed are also discussed from practical manufacturing perspective.
Chirped Pulse Amplification (CPA) is widely used for generating high-energy femtosecond pulses. This is most
commonly done with a solid-state Ti:Sapphire crystal through a free-space optical path. The high energy density in the
crystal and the precise optical path required with the use of bulk optics make it difficult to design a simple system with
good stability and beam quality over the environmental conditions typically encountered in the manufacturing
environment.
A CPA system using fiber architecture reduces the need for precise beam guiding since the light follows the fiber. The
pump energy is more evenly distributed along the length of the amplifier fiber, reducing the thermal dissipation that is
required (no water chiller is required) and improving the overall efficiency. The fiber architecture also produces a
superior quality beam that does not require great care to maintain.
IMRA's latest FCPA μJewel uses the inherent advantages of the FCPA architecture, along with extensive engineering, to
produce a compact and stable femtosecond fiber laser system. Its high repetition rate and stable performance enables
applications that were difficult to achieve previously.
This paper will review the general design architecture of the FCPA μJewel and discuss several applications.
Fiber lasers offer an excellent technology base for production of an industrial-quality tool for precision microfabrication, answering the need to expand the capabilities of laser material processing beyond traditional welding, cutting, and other industrial processes. IMRA's FCPA μJewelTM femtosecond fiber laser has been developed to address the particular need for direct-write lasers for creation of clean and high-quality micron and sub-micron features in materials of commercial interest. This flexible Yb:fiber chirped-pulse amplification architecture, capable of operating at rep-rates between 100 kHz and 5 MHz, balances the need for higher-repetition rate with that of sufficient pulse energy to work at or near ablation threshold, while meeting industrial standards for temperature, shock and vibration. Demonstration of the need for higher-repetition rates for direct write processes will be provided in this paper. Further, results of laser-processing of materials typically used in flat panel displays, photomasks, and waveguide production using the FCPA μJewelTM laser will be presented.
IMRA's ultrashort pulse fiber laser products continue to evolve to expand the application scope. The latest prototype FCPA produces pulses with less than 500-fs pulse duration at a 50-kHz repetition rate. At the fundamental wavelength of 1045 nm, the pulse energy is greater than 10 mJ. The increase in pulse energy over the standard FCPA μJewel permits greater flexibility in the focusing conditions applicable for micromachining, enabling a wider variety of laser-machined structures and profiles. This paper describes the latest micromachining application areas being studied with this new laser.
As applications demanding microJoule level pulses at "real-time" rates of delivery increase, and the expectations in terms of long-term, reliable, high quality performance become greater, fiber lasers are becoming increasingly attractive sources. When a combination of excellent beam quality, flexibility in design for repetition rate over 100 kHz - 5 MHz, and robust design for operation in a variety of environments, in a plug-and-play, non-water cooled package are necessary, IMRA’s fiber chirped-pulse amplifier (FCPA) system delivers in a compact, single-box solution. This type of laser has particular promise in precision material processing applications, enabling the use of technology that was previously considered too unstable or difficult to use. The basis for this advanced technology is a novel Yb:fiber oscillator/amplifier combination. The modular design architecture ensures a very robust construction that is well-suited to integration into commercial systems. To show the utility of such a laser in commercial applications, results of ablation thresholds and processing tests of various materials including metals and dielectrics are presented using IMRA’s FCPA μJewel femtosecond fiber laser.
Ti:Sapphire lasers remain the most widely used utlrafast laser. However, precise optical alignment and environmental control are necessary for continuous, long-term stable operatoin of the laser. IMRA's FCPA laser is an air-cooled, Yb fiber-based ultrafast laser designed to operate in an industrial environment and provide a stable, high-quality laser beam. In this work, the micromachining performance of the FCPA laser is directly compared with a conventional Ti:Sapphire regenerative amplifier laser. An experimental study was conducted to determine the ablation threshold and etch rate for a variety of materials (including metals, semiconductors, and dielectrics). The materials chosen for the experiments cover a wide range of optical, mechanical and physical properties. Similar focusing conditions were used for both lasers in order to ensure that any differences in the results are primarily due to the different characteristics of each laser. For materials with a relatively low ablation threshold, the full energy of the Ti:Sapphire laser is not needed. Furthermore, it is near the ablation threshold where ultrafast laser processing provides the benefit of minimal thermal damage to the surrounding material. Although the relatively low pulse energy of the FCPA limits its ability to ablate some harder materials, its high repetition rate increases the material processing speed and its good beam quality and stability facilitates tight, efficient focusing for precise machining of small features.
On the basis of highly efficient Yb:fiber amplifiers, a new technology platform for compact and nearly maintenance-free laser sources from the femtosecond to the nanosecond time scale has been developed, allowing their application-customized use in industrial laser material processing. The core of this technology is the patented use of multimode fibers with TEM00 output characteristics, enabling high and efficient amplification while maintaining high quality of the output beam. First, we review the fiber laser amplifier developments in the femtosecond pulse regime. Then, we present for the first time a picosecond seed source, Yb fiber amplifier laser design. Next, we present a completely new laser seeder/amplifier design, enabling online temporal tuning of laser pulses between 4 and 20 ns without changing pulse energy by utilizing high-speed control circuitry to adjust pulse duration, repetition rate and pulse energy independently. Pulse length can be optimized to process a given dimension of a sample structure that needs to be modified. Pulse shape can be controlled to produce almost rectangular pulses with <1.5 ns rise times. The resultant pulses can be transported by a polarization-maintaining delivery fiber for easy integration and use in material processing applications. Finally, we describe a few examples of micromachining using pulses from this new, flexible, fiber-based nanosecond laser source.
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