Dr. Jan-Erik Källhammer
Director Visual Enhancement & Cognitive Systems at Magna Sweden AB
SPIE Involvement:
Author
Area of Expertise:
Automotive Night Vision , Driver warning criteria , Pedestrian Detection
Websites:
Publications (7)

Proceedings Article | 27 October 2010 Paper
Per Ericsson, Linda Höglund, Björn Samel, Susan Savage, Stanley Wissmar, Olof Öberg, Jan-Erik Källhammer, Dick Eriksson
Proceedings Volume 7834, 78340Q (2010) https://doi.org/10.1117/12.865036
KEYWORDS: Bolometers, Absorption, Silicon, Quantum wells, Germanium, Semiconducting wafers, Resistance, Sensors, Temperature metrology, Far infrared

Proceedings Article | 14 May 2010 Paper
R. Schweiger, S. Franz, O. Löhlein, W. Ritter, J.-E. Källhammer, J. Franks, T. Krekels
Proceedings Volume 7726, 772610 (2010) https://doi.org/10.1117/12.855932
KEYWORDS: Sensors, Near infrared, Cameras, Night vision systems, Image sensors, Image resolution, Sensor fusion, Optical resolution, Image analysis, Far infrared

Proceedings Article | 13 June 2007 Paper
Proceedings Volume 6542, 65421M (2007) https://doi.org/10.1117/12.719163
KEYWORDS: Bolometers, Readout integrated circuits, Infrared bolometers, Infrared radiation, Infrared imaging, Thermal modeling, Semiconducting wafers, Atmospheric modeling, Performance modeling, Wafer bonding

Proceedings Article | 14 May 2007 Paper
Christian Vieider, Stanley Wissmar, Per Ericsson, Urban Halldin, Frank Niklaus, Göran Stemme, Jan-Erik Källhammer, Håkan Pettersson, Dick Eriksson, Henrik Jakobsen, Terje Kvisterøy, John Franks, Jan VanNylen, Hans Vercammen, Annick VanHulsel
Proceedings Volume 6542, 65421L (2007) https://doi.org/10.1117/12.721272
KEYWORDS: Semiconducting wafers, Bolometers, Sensors, Readout integrated circuits, Wafer bonding, Germanium, Cameras, Packaging, Quantum wells, Far infrared

Proceedings Article | 21 April 2006 Paper
Jan-Erik Källhammer, Håkan Pettersson, Dick Eriksson, Stéphane Junique, Susan Savage, Christian Vieider, Jan Andersson, John Franks, Jan Van Nylen, Hans Vercammen, Terje Kvisterøy, Frank Niklaus, Göran Stemme
Proceedings Volume 6198, 619809 (2006) https://doi.org/10.1117/12.663152
KEYWORDS: Long wavelength infrared, Sensors, Germanium, Semiconducting wafers, Bolometers, Wafer bonding, Manufacturing, Cameras, Readout integrated circuits, Packaging

Showing 5 of 7 publications
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top