Prof. Göran Stemme Profile

Prof. Göran Stemme

at KTH Royal Institute of Technology

SPIE Involvement:

Author

Publications (11)

Proceedings Article | 5 March 2021 Presentation + Paper

Wafer-level vacuum sealing for packaging of silicon photonic MEMS

Gaehun Jo, Pierre Edinger, Simon Bleiker, Xiaojing Wang, Alain Yuji Takabayashi, Hamed Sattari, Niels Quack, Moises Jezzini, Peter Verheyen, Göran Stemme, Wim Bogaerts, Kristinn Gylfason, Frank Niklaus

Proceedings Volume 11691, 116910E (2021) https://doi.org/10.1117/12.2582975

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Proceedings Article | 22 February 2018 Presentation + Paper

New dynamic silicon photonic components enabled by MEMS technology

Carlos Errando-Herranz, Pierre Edinger, Marco Colangelo, Joel Björk, Samy Ahmed, Göran Stemme, Frank Niklaus, Kristinn Gylfason

Proceedings Volume 10537, 1053711 (2018) https://doi.org/10.1117/12.2297588

KEYWORDS: Waveguides, Microelectromechanical systems, Silicon, Silicon photonics, Dispersion, Resonators, Etching, Tunable filters, Dry etching, Integrated optics

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Proceedings Article | 1 May 2014 Paper

High-frequency sub-wavelength IR thermal source

Floria Ottonello Briano, Pauline Renoux, Fredrik Forsberg, Hans Sohlström, Snorri Ingvarsson, Göran Stemme, Kristinn Gylfason

Proceedings Volume 9133, 91331D (2014) https://doi.org/10.1117/12.2052457

KEYWORDS: Thermography, Resistance, Platinum, Temperature metrology, Thermal modeling, Resistors, Photodetectors, Light, Infrared imaging, Nanowires

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Proceedings Article | 21 May 2011 Paper

Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays

Per Ericsson, Andreas Fischer, Fredrik Forsberg, Niclas Roxhed, Björn Samel, Susan Savage, Göran Stemme, Stanley Wissmar, Olof Öberg, Frank Niklaus

Proceedings Volume 8012, 801216 (2011) https://doi.org/10.1117/12.883827

KEYWORDS: Bolometers, Absorption, Quantum wells, Semiconducting wafers, Silicon, Sensors, Resistance, Infrared radiation, Reflectors, Wafer bonding

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Proceedings Article | 13 June 2007 Paper

Uncooled infrared bolometer arrays operating in a low to medium vacuum atmosphere: performance model and tradeoffs

Frank Niklaus, Christer Jansson, Adit Decharat, Jan-Erik Källhammer, Håkan Pettersson, Göran Stemme

Proceedings Volume 6542, 65421M (2007) https://doi.org/10.1117/12.719163

KEYWORDS: Bolometers, Readout integrated circuits, Infrared bolometers, Infrared radiation, Infrared imaging, Thermal modeling, Semiconducting wafers, Atmospheric modeling, Performance modeling, Wafer bonding

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Proceedings Article | 14 May 2007 Paper

Low-cost far infrared bolometer camera for automotive use

Christian Vieider, Stanley Wissmar, Per Ericsson, Urban Halldin, Frank Niklaus, Göran Stemme, Jan-Erik Källhammer, Håkan Pettersson, Dick Eriksson, Henrik Jakobsen, Terje Kvisterøy, John Franks, Jan VanNylen, Hans Vercammen, Annick VanHulsel

Proceedings Volume 6542, 65421L (2007) https://doi.org/10.1117/12.721272

KEYWORDS: Semiconducting wafers, Bolometers, Sensors, Readout integrated circuits, Wafer bonding, Germanium, Cameras, Packaging, Quantum wells, Far infrared

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Proceedings Article | 15 February 2007 Paper

MEMS for medical technology applications

Thomas Frisk, Niclas Roxhed, Göran Stemme

Proceedings Volume 6465, 646513 (2007) https://doi.org/10.1117/12.716948

KEYWORDS: Liquids, Skin, Interfaces, Microsystems, Silicon, Crystals, Microelectromechanical systems, Tissues, Microfluidics, Composites

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Proceedings Article | 21 April 2006 Paper

Fulfilling the pedestrian protection directive using a long-wavelength infrared camera designed to meet both performance and cost targets

Jan-Erik Källhammer, Håkan Pettersson, Dick Eriksson, Stéphane Junique, Susan Savage, Christian Vieider, Jan Andersson, John Franks, Jan Van Nylen, Hans Vercammen, Terje Kvisterøy, Frank Niklaus, Göran Stemme

Proceedings Volume 6198, 619809 (2006) https://doi.org/10.1117/12.663152

KEYWORDS: Long wavelength infrared, Sensors, Germanium, Semiconducting wafers, Bolometers, Wafer bonding, Manufacturing, Cameras, Readout integrated circuits, Packaging

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Proceedings Article | 30 August 2004 Paper

Characterization of transfer-bonded silicon bolometer arrays

Frank Niklaus, Johan Pejnefors, Matteo Dainese, Michael Haggblad, Per-Erik Hellstrom, Ulf Wallgren, Goran Stemme

Proceedings Volume 5406, (2004) https://doi.org/10.1117/12.565894

KEYWORDS: Bolometers, Silicon, Semiconducting wafers, Readout integrated circuits, Infrared detectors, Resistors, Infrared bolometers, Material characterization, Wafer bonding, Boron

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Proceedings Article | 10 October 2001 Paper

New concept for CMOS-compatible fabrication of uncooled infrared focal plane arrays using wafer-scale device transfer bonding

Frank Niklaus, Edvard Kaelvesten, Goeran Stemme

Proceedings Volume 4369, (2001) https://doi.org/10.1117/12.445334

KEYWORDS: Semiconducting wafers, Bolometers, Sensors, Wafer bonding, Target detection, Silicon, Infrared detectors, Etching, Aluminum, Electrodes

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Proceedings Article | 1 October 1999 Paper

3D micromachined devices based on polyimide joint technology

Thorbjoern Ebefors, Johan Ulfstedt-Mattsson, Edvard Kaelvesten, Goeran Stemme

Proceedings Volume 3892, (1999) https://doi.org/10.1117/12.364509

KEYWORDS: Silicon, Sensors, Actuators, Semiconducting wafers, Fabrication, Metals, Surface micromachining, Resistance, Temperature metrology, Bulk micromachining

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Showing 5 of 11 publications

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