Higher reliability and power efficiency achieved with low-demanding cooling make single emitter diodes a more
effective pump source than monolithic laser diode arrays. Continuously improving performance and increasing
brightness of single emitter pumps are accompanied with a steady reduction of cost of pumping (dollar-per-watt).
Performance advantages do not compromise reliability of the pumps. These features ensure that single emitter diodes are
the most effective solution even for multi-kWatt systems pumping. Here we report on a recent progress in single-mode
and multi-mode edge-emitting diodes.
High-power high-brightness multimode edge emitting pumps have been developed. Comprehensive development efforts have resulted in 3 mm-long cavity diodes with far-field divergence reduced down to 26°. Output in excess of 20W CW from 90 μm-wide aperture single emitter was demonstrated for the first time. Peak power was reached at 25A CW
driving current and was limited by power supply. Peak CW power efficiency was as high as 67%. Two coolerless package types designed to operate up to 10W output and up to 20W output are reported. About 95% fiber coupling efficiency into NA<0.12 was demonstrated in the entire range of driving currents for both types of pumps. For packages of the later design efficiency over 50% is maintained up to 16W CW ex-fiber output. Diode junction overheat above heatsink temperature is less than 20°C up to ~ 18W ex-fiber output.
Valentin Gapontsev, Igor Berishev, Glenn Ellis, Alexey Komissarov, Nikolay Moshegov, Oleg Raisky, Pavel Trubenko, Vladimir Ackermann, Eugene Shcherbakov, Jorg Steinecke, Alexander Ovtchinnikov
Ultra-reliable very efficient multimode diodes have been developed. 90 micrometer wide aperture chip-on-submount demonstrate 67% peak power conversion efficiency at 25°C and 60% peak power efficiency at 85°C heatsink temperature; while record high thermal limited peak power in excess of 15 W CW is achieved at 15°C. State-of-the-art performance of Chip-on-Submount does not compromise its reliability; over 1,000,000 hours Mean Time Between Failures has been demonstrated. Cooler-less package design ensures thermal resistance of 4.5°C/W from the Chip-on-Submount to external heatsink; coupling efficiency of 95% into 0.15 NA at over 5 W power in 100 μm dia. fiber are routinely obtained. Results of multi-cell accelerated tests of packaged pumps yielded over 10 years of uninterrupted use MTBF at over 5W CW ex-fiber output.
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