We have improved the conventional polarization method used to separate and simultaneously capture the moiré interferometry fringe patterns of the U and V fields. The beamsplitter grating and integrated analyzers in the conventional method are substituted for with a Wollaston prism. The operation of this method is thus simplified and quality of the fringe patterns can be improved. Furthermore, it is easy to implement this technique in compact moiré interferometry system with a minimum of additional components. The key points of operation are stressed and an application of this improved method is presented to show its feasibility. Also, the system error due to the use of this technique is analyzed.
KEYWORDS: Fringe analysis, Chemical analysis, Deflectometry, Silicon, Reliability, 3D modeling, Packaging, Finite element methods, Temperature metrology, Thermal modeling
Thermo-mechanical reliability is a key issue of IC packaging. In this paper, the chemical shrinkage stress caused by the underfill curing is quantitatively investigated: DSC test result provides the basis for the determination of temperature profile for the curing of underfill. The 3D deformation of the flip chip during the underfill curing process is measured with 3D Moire interferometry system. Also a simple theoretical model is set up for this problem, DMA test provide the necessary parameters for this model. The experimental and theoretical results agree well with each other, both results show that the chemical shrinkage stress is fairly small when compared with the thermal residual stress, so this part of residual stress can be neglected in the commonly used finite element analysis (FEA) model.
In this paper, an integrated 3D moire system is introduced and the complex thermo-mechanical behavior of plastic packages is revealed with this system. Testing results show the thermo- mechanical behavior of plastic packages is time dependent, thermal experience dependant and moisture sensitive. The introduced 3D Moire system and testing result provide a basis for further investigation on this problem, e.g. it can provide boundary condition or result confirmation for the FEM investigation.
The mechanical reliability of electronic packaging is a topic of concern. Characterization of the thermo-mechanical behavior including the thermal stress/strain of electronic packages is critical for this topic. In this paper, current principal experimental methods used for this purpose are reviewed, their advantages and disadvantages are analyzed, also their newest applications are introduced. The hybrid method that takes the advantage of experimental methods and finite elemental method -- FEM is pointed out to be the best investigation method and represents a developing direction.
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