Dr. Estefanía Abad Profile

Dr. Estefanía Abad

at Fundación TEKNIKER

SPIE Involvement:

Author

Publications (3)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 15 May 2007 Paper

Fabrication process for a flexible tag microlab

E. Abad, B. Mazzolai, A. Juarros, D. Gómez, A. Mondini, I. Sayhan, A. Krenkow, Th. Becker

Proceedings Volume 6589, 65890O (2007) https://doi.org/10.1117/12.723737

KEYWORDS: Sensors, Gas sensors, Copper, Prototyping, Resistance, Flexible circuits, Adhesives, Laser ablation, Optical lithography, Antennas

Read Abstract +

The aim of this paper is to present an integrated process flow for a smart tag with integrated sensors and RFID communication, a Flexible Tag Microlab (FTM). The heart of the designed container tracing system is an RFID system (Reader + Tag) with gas sensing capabilities on board. In the former prototypes, the chemical sensors were integrated on the reader, whereas the tags where addressed like conventional RFID-tags containing also physical (temperature, humidity and light) sensors. However, this paper will show how the gas sensing reader functionalities are being transferred to the tag, reaching a flexible tag microlab, which represents a real innovation in the field of flexible labels. Key issues for the realisation of the FTM, such us flexible substrates and gas sensor integration technologies will be presented. The process flow employed for the two metal levels interconnect fabrication will be described in detail. The material used is the DuPont^TM Pyralux^(R) AP 8525R double-sided copper-clad laminate, formed by a Kapton foil with a copper layer on each side. The vias and windows openings are performed by femtosecond laser ablation. The copper interconnections are realized by photolithography and wet chemical etching. The MOX sensors hotplates specially developed to fulfil the FTM constrains in terms of low power consumption has been used to prove two integration technologies into the flexible substrates: Chip on Flex (COF) wire bonding and Anisotropic Conductive Adhesive (ACA) flip chip bonding. Both technologies will be compared and benchmarked for future product developments.

Proceedings Article | 1 July 2005 Paper

Development of a flexible tag microlab

Estefania Abad, Vittoria Simona Raffa, Barbara Mazzolai, Santiago Marco, Angelika Krenkow, Thomas Becker

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.607856

KEYWORDS: Adhesives, Copper, Optical lithography, Wet etching, Laser ablation, Photomasks, Metals, Femtosecond phenomena, Assembly equipment, Sensors

Read Abstract +

The objective of this ongoing work is the development of a microlab on flexible tag, capable to monitor the quality of the food, during transport, storage and vending. The idea is to bring together different sensor technologies that will be integrated into a data communication environment for online food monitoring during the logistics chain. The proposed solution is the concept of silicon chips and microcomponents assembled and integrated on top of a flexible substrate acting mainly as a passive interconnect structure. Three technologies have been identified as necessary to get the final integration: a) Substrate technology. This technology refers to the realisation of the flexible substrate with the metallic interconnections. b) Assembly technology to integrate the discrete components on the flexible substrate. The conventional processes are wire bonding, flip chip, and adhesive bonding. c) Encapsulation technology and windows opening over the gas sensitive areas. The first flexible tag prototype integrates two different metal oxide sensor arrays with a commercial microprocessor. The dimensions are 43 mm long, 22 mm wide and about 2 mm thick and two metal levels are necessary for the interconnect. The strategy undertaken by the groups involved in this work, consists in the evaluation of different approaches, that combine diverse process sequences and materials, with the final aim of identifying the best solution. Regarding the substrate technology, the approach realized using Pyralux copper-clad laminated composites, constructed of DuPont Kapton polyimide film with copper foil on both sides, as flexible substrate will be described in this paper. The cupper interconnections are generated by standard photolithography and wet etching and the vias definition in Kapton is performed by femtosecond laser ablation. On the other hand, the assembly technology based on the use of anisotropically conductive adhesives will be also illustrated.

Proceedings Article | 24 April 2003 Paper

Soft lithographic patterning of oxide thin films

Estefania Abad, Roger Whatmore, Qi Zhang, Zhaorong Huang

Proceedings Volume 5116, (2003) https://doi.org/10.1117/12.499780

KEYWORDS: Gold, Etching, Ferroelectric materials, Thin films, Reactive ion etching, Lithography, Microchannel plates, Optical lithography, Wet etching, Photomasks

Read Abstract +

An emerging non-photolithographic technology, soft lithography, is applied with the aim of patterning ferroelectric thin film oxides, in particular sol-gel deposited Lead Zirconate Titanate (PZT). Soft lithography relies on the replication of a patterned master using an elastomeric material and then, using this as a stamp to create micro- and nanometer scale patterns and structures. Following this procedure, a set of masters were fabricated both using photolithographic and Focused Ion Beam (FIB) methods. Masters were replicated using a commercial polymer (PDMS), satisfactorily reproducing the negative of the master’s features down to a limit of 500 nm. The obtained stamps were used to produce patterned self-assembled monolayers (SAMs) of alkanethiols over surfaces of gold, using the technique of microcontact printing (mCP). The patterned SAMs were then employed as a molecular thin resist to create microstructures of gold by wet etching. This is a key step for establishing a new route for the fabrication of ferroelectric thin film capacitors made of Pt/PZT/Au by Reactive Ion Etching (RIE) using the patterned gold features as both mask and top electrode, thus avoiding alignment stages in the fabrication procedure.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years