Eric Solecky
Process Engineer at GlobalFoundries
SPIE Involvement:
Author | Instructor
Publications (32)

Proceedings Article | 22 March 2018 Presentation + Paper
Proceedings Volume 10585, 105850I (2018) https://doi.org/10.1117/12.2296679
KEYWORDS: Metrology, Critical dimension metrology, Scanning electron microscopy, 3D metrology, Silicon, X-rays, Overlay metrology, Fin field effect transistors, Process control, Image resolution

Proceedings Article | 28 March 2017 Paper
Proceedings Volume 10145, 101450G (2017) https://doi.org/10.1117/12.2260870
KEYWORDS: Critical dimension metrology, Nanowires, Metrology, X-rays, Semiconductors, Logic, Overlay metrology, 3D metrology, Signal processing, Inspection, Signal to noise ratio, High volume manufacturing, Silicon, Scanning electron microscopy, Image resolution

Proceedings Article | 28 March 2017 Presentation + Paper
Eric Solecky, Allen Rasafar, Jason Cantone, Benjamin Bunday, Alok Vaid, Oliver Patterson, Andrew Stamper, Kevin Wu, Ralf Buengener, Weihao Weng, Xintuo Dai
Proceedings Volume 10145, 101450R (2017) https://doi.org/10.1117/12.2261524
KEYWORDS: Defect inspection, Metrology, Process control, Critical dimension metrology, Inspection, Optical lithography, Semiconducting wafers, Dimensional metrology, Overlay metrology, Manufacturing, Electron beam lithography, Image resolution, Scanning electron microscopy, Image processing

SPIE Press Book | 25 September 2015
KEYWORDS: Metrology, Semiconducting wafers, Overlay metrology, Manufacturing, Photomasks, Inspection, Process control, Critical dimension metrology, Calibration, Semiconductors

Proceedings Article | 19 March 2015 Paper
Xiaoxiao Zhang, Patrick Snow, Alok Vaid, Eric Solecky, Hua Zhou, Zhenhua Ge, Shay Yasharzade, Ori Shoval, Ofer Adan, Ishai Schwarzband, Maayan Bar-Zvi
Proceedings Volume 9424, 94240G (2015) https://doi.org/10.1117/12.2087267
KEYWORDS: Semiconducting wafers, 3D metrology, Overlay metrology, Metrology, Optical testing, Critical dimension metrology, Atomic force microscopy, Image segmentation, Scanning electron microscopy, Back end of line

Showing 5 of 32 publications
Conference Committee Involvement (9)
Metrology, Inspection, and Process Control XXXVI
25 April 2022 | San Jose, California, United States
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV
22 February 2021 | Online Only, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXIV
24 February 2020 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXIII
25 February 2019 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXII
26 February 2018 | San Jose, California, United States
Showing 5 of 9 Conference Committees
Course Instructor
SC1133: Advanced Concepts in Metrology Toolset Stability and Matching
The course covers advanced concepts for metrology toolset stability and matching. It will cover many critical topics that together maximize fleet performance. This is especially important given the shift to new device architectures (finfet, 3D Flash, DRAM and advanced memory ) that are challenging metrology toolsets in ways not seen before. A number of advanced concepts will be covered. Review best known methods for gauge study analysis and metrics. Appropriately setting up tool control chart limits for long term stability fleet matching based on requirements not historical data. Leveraging real time normalized product data to decrease Mean Time To Detect (MTTD) tool drifts. Recipe portability matching and monitoring to catch other issues that will affect lot cycletime. The concepts discussed are applicable to any metrology toolset such as CD-SEM, overlay, thin film, AFM, etc. and most of these concepts are also applicable to defect toolsets.
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