Mr. Eric Chin Profile

Eric Chin

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Publications (5)

Proceedings Article | 19 May 2011 Paper

Collaborative research on emerging technologies and design

Andrew Neureuther, Juliet Rubinstein, Marshal Miller, Kenji Yamazoe, Eric Chin, Cooper Levy, Lynn Wang, Nuo Xu, Costas Spanos, Kun Qian, Kameshwar Poolla, Justin Ghan, Anand Subramanian, Tsu-Jae King Liu, Xin Sun, Kwangok Jeong, Puneet Gupta, Abde Kaqalwalla, Rani Ghaida, Tuck Boon Chan

Proceedings Volume 8081, 80810N (2011) https://doi.org/10.1117/12.899394

KEYWORDS: Photomasks, Double patterning technology, Lithography, Image processing, Line edge roughness, Algorithm development, Reticles, Inspection, Design for manufacturing, Device simulation

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Proceedings Article | 3 April 2010 Paper

Variability aware timing models at the standard cell level

Eric Chin, Cooper Levy, Andrew Neureuther

Proceedings Volume 7641, 76410H (2010) https://doi.org/10.1117/12.846689

KEYWORDS: Transistors, Lithography, Device simulation, Instrument modeling, Capacitance, Performance modeling, 193nm lithography, Standards development, Data modeling, Semiconducting wafers

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Proceedings Article | 13 March 2009 Paper

Variability aware interconnect timing models for double patterning

Eric Chin, Andrew Neureuther

Proceedings Volume 7275, 727513 (2009) https://doi.org/10.1117/12.814281

KEYWORDS: Double patterning technology, Lithography, Metals, Capacitance, Critical dimension metrology, Optical lithography, Resistance, Device simulation, Signal processing, Instrument modeling

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Proceedings Article | 28 March 2007 Open Access

Collaborative platform, tool-kit, and physical models for DfM

Andy Neureuther, Wojtek Poppe, Juliet Holwill, Eric Chin, Lynn Wang, Jae-Seok Yang, Marshal Miller, Dan Ceperley, Chris Clifford, Koji Kikuchi, Jihong Choi, Dave Dornfeld, Paul Friedberg, Costas Spanos, John Hoang, Jane Chang, Jerry Hsu, David Graves, Alan Wu, Mike Lieberman

Proceedings Volume 6521, 652104 (2007) https://doi.org/10.1117/12.721199

KEYWORDS: Design for manufacturing, Photomasks, Device simulation, Computer aided design, Process modeling, Etching, Monochromatic aberrations, Manufacturing, Lithography, Chemical mechanical planarization

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Proceedings Article | 21 March 2007 Paper

Prediction of interconnect delay variations using pattern matching

Eric Chin, Juliet Holwill, Andrew Neureuther

Proceedings Volume 6521, 65210I (2007) https://doi.org/10.1117/12.712257

KEYWORDS: Capacitance, Resistance, Lithography, Monochromatic aberrations, Metals, Process modeling, Etching, Chemical mechanical planarization, Critical dimension metrology, Inspection

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