GeSn alloys have emerged as a promising material for realizing CMOS-compatible light sources. GeSn lasers demonstrated to date have large device footprints and active areas, which limit the realization of densely integrated lasers operating at low power consumption. Thanks to their intrinsically small device form factors, 1D photonic crystal lasers may offer opportunities to overcome such limitations of large GeSn lasers. Here, we present a 1D photonic crystal nanobeam laser with a very small device footprint (~7 μm2) and a compact active area (~1.2 μm2) on a GeSn-on-insulator substrate.
In the quest for practical group IV lasers, researchers have proposed a few ideas such as strain engineering of Ge and alloying of Sn into Ge. Both approaches fundamentally alter bandstructure such that Ge can become a direct bandgap material. Recently, relaxation of limiting compressive strain and addition of mechanical tensile strain have been employed to improve the lasing performance. However, such strain engineering has thus far been possible only in suspended device configurations, which significantly limit heat dissipation and hinder the device performance. We herein demonstrate GeSn microdisk lasers fully released on Si that relax the limiting compressive strain and achieve excellent thermal conduction.
The potential for establishing energy gaps by pseudo-magnetic fields in strain-engineered graphene has sparked much interest recently. However, the limited sizes of induced pseudo-magnetic fields and the complicated platforms for straining graphene have thus far prevented researchers from harnessing the unique pseudo-magnetic fields in optoelectronic devices. In this work, we present an experimental demonstration of triaxially strained suspended graphene structures capable of obtaining quasi-uniform pseudo-magnetic fields over a large scale. The novel metal electrode design functions as both stressors and current injectors. We also propose a hybrid laser structure employing a 2D photonic crystal and triaxially strained graphene as an optical cavity and gain medium, respectively.
Combining Sn alloying and tensile strain to Ge has emerged as the most promising engineering approach to create an efficient Si-compatible lasing medium. The residual compressive strain in GeSn has thus far made the simple geometrical strain amplification technique unsuitable for achieving tensile strained GeSn. Herein, by utilizing two unique techniques, we report the introduction of a uniaxial tensile strain directly into GeSn micro/nanostructures. By converting GeSn from indirect to direct bandgap material via tensile strain, we achieve a 10-fold increase in the light emission intensity.
The development of a semiconductor laser compatible with silicon substrates and high-volume silicon integrated circuit manufacturing is a key requirement for monolithic silicon photonic transceivers. Tensile strained germanium is a promising material system which meets these criteria, and both optically pumped and electrically injected lasing have been reported[1,2]. It is well established that growth of thick (~1 micron) layers of germanium on silicon substrates by two-stage chemical vapour deposition followed by thermal annealing results in nearly-relaxed germanium with a residual biaxial tensile strain of typically 0.15-0.25% [3]. Several researchers have investigated methods of amplifying this built-in strain in order to increase the attainable optical gain. Increased uniaxial strain levels have been demonstrated in suspended linear bridge structures created by wet chemical underetching. However, uniaxial strain is less effective than biaxial strain in converting germanium from an indirect to a direct gap semiconductor and hence generating substantial optical gain. In this work, we have computationally investigated and optimised two-dimensional patterning and under-etching of germanium membranes in order to achieve biaxial strain amplification. Strain simulations were carried out using finite element methods and the shape of the suspended germanium structures was optimised to achieve the highest tensile strain whilst remaining below the empirically determined yield strength of the thin membranes. The net optical gain distribution across the membrane was calculated using 8 band k.p bandstructure to determine the full interband gain, the inter-valence-band absorption and the intervalley and intravalley phonon- and impurity-assisted free carrier absorption. Band-gap narrowing effects were included using empirical data. Biaxial strain values of ~1% can be achieved in the lasing region of the structure, which, although below the level required to convert germanium to a direct band-gap material, nonetheless result in net optical gain with practical (mid 1019cm-3) n-type doping densities, for a range of electrical injection conditions.
References
1.J Liu et al, Opt. Lett 35 679 (2010)
2. R Camacho-Aguilera et al, Opt. Express 20 11316 (2012)
3. R Camacho-Aguilera et al, Appl. Phys. Lett 102 152106 (2013)
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.