This paper concerns a beam-like two-axis piezoelectric actuator, suitable either for MEMS implementation using piezoelectric films deposited on a single surface of a substrate or for larger scale implementations using bulk piezoelectric actuator plates. An analysis of the mechanics of actuator is presented that quantifies the actuation effect in two perpendicular directions, depending on the pahsing of the actuation voltages applied. The analysis, based on consideration of the stress and strain transfer between the active and passive parts of the structure, extends previously published work on single-axis actuators and leads to the development of simple analytical formulae that are useful for design purposes. Comparison of analytical predictions with Finite Element simulations gives confidence in the validity of the analytical model.
Single-axis rate sensors (rate gyroscopes) that utilize Coriolis coupling between a single pair of modes of a simple vibrating structure have been widely researched and are being used in increasing numbers in a range of aerospace, automotive and other applications. To meet market demands for such sensors, there are now significant pressures to reduce cost and size and to improve basic performance. Size and cost reduction will be achieved via MEMS
technology, but size reduction and performance improvement are often conflicting requirements. This paper examines some smart alternatives to simple size reduction. The presented concepts allow more information to be measured by a single sensor structure by using more of the available spectrum of vibration modes available in the sensor structure. The concepts are illustrated in the form of a multi-channel rate sensor based on a vibrating cylinder and a multi-axis rate sensor based on a vibrating ring. Test results from prototype sensors are presented.
This paper relates to the development of a novel rate sensor for a wide range of potential applications in the automotive field, amongst others. The sensor is based on the dynamic behavior of an active, vibrating silicon structure that uses thin-film piezoelectric material for actuation and sensing functions, and can be manufactured using silicon micro-machining techniques. The use of piezo-electric material for drive and pickoff offers potentially significant advantages over electrostatic/capacitive means in terms of achievable actuation forces and simplicity of structural design. This paper gives an overview of the design and analysis of a prototype sensor. The design concept is described and a low-order mathematical model, incorporating the inertial behavior of the structure and the interaction between the silicon structure and the piezo-drives and pickoffs is presented. This model allows the basic sensitivity of the sensor to be quantified. The design of a prototype sensor is then described. Some preliminary test results are presented, illustrating the feasibility of the concept.
Current developments in RF systems require high-performance switches for applications including signal routing, impedance matching and adjustable gain amplifiers. The use of micro-switches to replace traditional semiconductor components is increasingly common, because of their advantages in terms of electrical isolation and power loss. This paper reports on a research program relating to the development of a silicon micro-machined RF micro-switch that uses thin-film piezoelectric material for actuation. Piezoelectric actuation has potential advantages over electrostatic actuation in terms of achievable forces and simplicity of structural design. This paper gives an overview of the design and analysis of a prototype switch. The design concept, based on a cantilevered silicon beam or plate, is described. A low order mathematical model, incorporating the mechanical and electrical characteristics of the switch and the interaction between the silicon structure and the piezo-drive is summarized. This allows the basic behavior of the switch to be quantified, and provides a useful tool for design and optimization purposes. The outline design and manufacture/processing of a prototype switch is discussed.
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