The making of composite parts involves laying down multiple layers of tape in an organized manner. Misplaced ends, wrinkles or other factors can cause the part being built to have weaknesses or other imperfections. However, the actual edges of the tape do not stand out well with each layer reacting differently to lighting. The fiber nature of the tape will make the surface appear bright in some orientations and very dark in other. To complicate the problem, each layer of tape needs to be laid down at different angles, so can be dark, light or in-between, and at positions to fairly tight tolerances. This paper presents a study of several methods for determining the tape position and flaws, as well as details of a structured light method for determining the tape position. Considerations of tolerances, experimental results and how such a system might be implemented will be presented.
In this paper, the design and evaluation of a 3D stereo, near infrared (IR), defect mapping system for CZT inspection is
described. This system provides rapid acquisition and data analysis that result in detailed mapping of CZT crystal defects
across the area of wafers up to 100 millimeter diameter and through thicknesses of up to 20 millimeter. In this paper,
system characterization has been performed including a close evaluation of the bright field and dark field illumination
configurations for both wafer-scale and tile-scale inspection. A comparison of microscope image and IR image for the
same sample is performed. As a result, the IR inspection system has successfully demonstrated the capability of
detecting and localizing inclusions within minutes for a whole CZT wafer. Important information is provided for
selecting defect free areas out of a wafer and thereby ensuring the quality of the tile. This system would support the CZT
wafer dicing and assembly techniques that enable the economical production of CZT detectors. This capability can
improve the yield and reduce the cost of the thick detector devices that are rarely produced today.
CdZnTe is a high efficiency, room temperature radiation detection material that has attracted great interesting in
medical and security applications. CZT crystals can be grown by various methods. Particularly, CZT grown with the
Transfer Heater Method (THM) method have been shown to have fewer defects and greater material uniformity. In this
work, we developed a proof-of-concept dual lighting NIR imaging system that can be implemented to quickly and
nondestructively screen CZT boule and wafers during the manufacturing process. The system works by imaging the
defects inside CZT at a shallow depth of focus, taking a stack of images step by step at different depths through the
sample. The images are then processed with in-house software, which can locate the defects at different depths, construct
the 3D mapping of the defects, and provide statistical defect information. This can help with screening materials for use
in detector manufacturing at an early stage, which can significantly reduce the downstream cost of detector fabrication.
This inspection method can also be used to help the manufacturer understand the cause of the defect formation and
ultimately improve the manufacturing process.
Current spectroscopic detector crystals contain defects that prevent economic production of devices with sufficient
energy resolution and stopping power for radioisotope discrimination. This is especially acute for large monolithic
crystals due to increased defect opportunity. The proposed approach to cost reduction starts by combining stereoscopic
IR and ultrasound (UT) inspection coupled with segmentation and 3D mapping algorithms. A "smart dicing" system
uses "random-access" laser-based machining to obtain tiles free of major defects. Application specific grading matches
defect type to anticipated performance. Small pieces combined in a modular sensor pack instead of a monolith will
make the most efficient use of wafer area.
In some applications such as field stations, disaster situations or similar conditions, it is desirable to have a contactless,
rugged means to collect fingerprint information. The approach described in this paper enables acceleration of the
capture process by eliminating an otherwise system and finger cleanup procedure, minimizes the chance of the spread of
disease or contaminations, and uses an innovative optical system able to provide rolled equivalent fingerprint
information desirable for reliable 2D matching against existing databases. The approach described captures highresolution
fingerprints and 3D information simultaneously using a single camera. Liquid crystal polarization rotators
combined with birefringent elements provides the focus shift and a depth from focus algorithm extracts the 3D data. This
imaging technique does not involve any moving parts, thus reducing cost and complexity of the system as well as
increasing its robustness. Data collection is expected to take less than 100 milliseconds, capturing all four-finger images
simultaneously to avoid sequencing errors. This paper describes the various options considered for contactless
fingerprint capture, and why the particular approach was ultimately chosen.
KEYWORDS: Cameras, Defect detection, Signal to noise ratio, Imaging systems, Sensors, 3D metrology, 3D image processing, Interference (communication), Image analysis, Detection and tracking algorithms
The fabrication of new optical materials has many challenges that suggest the need for new metrology tools. To this
purpose, the authors designed a system for localizing 10 micron embedded defects in a 10-millimeter thick semitransparent
medium. The system, comprising a single camera and a motion system, uses a combination of brightfield and
darkfield illumination. This paper describes the optical design and algorithm tradeoffs used to reach the desired detection
and measurement characteristics using stereo photogrammetry and parallel-camera stereoscopic matching. Initial
experiment results concerning defect detection and positioning, as well as analysis of computational complexity of a
complete wafer inspection are presented. We concluded that parallel camera stereoscopic matching combined with
darkfield illumination provides the most compatible solution to the 3D defect detection and positioning requirement,
detecting 10 micron defects at a positioning accuracy of better than +/- 0.5 millimeters and at a speed of less than 3
minutes per part.
This paper describes a real time, low cost part metrology method for capturing and extracting 3D part data using a
single camera and no moving elements. 3D capture in machine vision is typically done using stereo photogrammetry,
phase shifting using structured light, or autofocus mechanism for depth capture. These methods rely on expensive and
often slow components such as multiple cameras, specialized lighting, or motion components such as motors or
piezoelectric actuators. We demonstrated a method for 3D capture using only a single camera, birefringent lenses and
ultra-fast electronic polarization switches. Using multiple images acquired at different polarization states and thus
different focal distances, a high-resolution 3D point cloud of a test part was extracted with a good match to the ground
truth data. This paper will describe the operation of the method and discuss the practical limitations.
The field of 3D optical metrology has seen significant growth in the commercial market in recent years. The methods of using structured light to obtain 3D range data is well documented in the literature, and continues to be an area of development in universities. However, the step between getting 3D data, and getting geometrically correct 3D data that can be used for metrology is not nearly as well developed. Mechanical metrology systems such as CMMs have long established standard means of verifying the geometric accuracies of their systems. Both local and volumentric measurments are characterized on such system using tooling balls, grid plates, and ball bars. This paper will explore the tools needed to characterize and calibrate an optical metrology system, and discuss the nature of the geometric errors often found in such systems, and suggest what may be a viable standard method of doing characterization of 3D optical systems. Finally, we will present a tradeoff analysis of ways to correct geometric errors in an optical systems considering what can be gained by hardware methods versus software corrections.
Electromagnetic (EM) tracking systems have been successfully used for Surgical Navigation in ENT, cranial, and spine
applications for several years. Catheter sized micro EM sensors have also been used in tightly controlled cardiac
mapping and pulmonary applications. EM systems have the benefit over optical navigation systems of not requiring a
line-of-sight between devices. Ferrous metals or conductive materials that are transient within the EM working volume
may impact tracking performance. Effective methods for detecting and reporting EM field distortions are generally well
known. Distortion compensation can be achieved for objects that have a static spatial relationship to a tracking sensor.
New commercially available micro EM tracking systems offer opportunities for expanded image-guided navigation
procedures. It is important to know and understand how well these systems perform with different surgical tables and
ancillary equipment. By their design and intended use, micro EM sensors will be located at the distal tip of tracked
devices and therefore be in closer proximity to the tables.
Our goal was to define a simple and portable process that could be used to estimate the EM tracker accuracy, and to
vet a large number of popular general surgery and imaging tables that are used in the United States and abroad.
This paper proposes an assessment protocol that incorporates both hardware and analysis methods for evaluation of
electromagnetic tracker accuracy in different clinical environments. The susceptibility of electromagnetic tracker
measurement accuracy is both highly dependent on nearby ferromagnetic interference sources and non-isotropic. These
inherent limitations combined with the various hardware components and assessment techniques used within different
studies makes the direct comparison of measurement accuracy between studies difficult. This paper presents a multicenter
study to evaluate electromagnetic devices in different clinical environments using a common hardware phantom
and assessment techniques so that results are directly comparable. Measurement accuracy has been shown to be in the
range of 0.79-6.67mm within a 180mm3 sub-volume of the Aurora measurement space in five different clinical
environments.
Optical tracking systems have been used for several years in image guided medical procedures. Vendors often state static accuracies of a single retro-reflective sphere or LED. Expensive coordinate measurement machines (CMM) are used to validate the positional accuracy over the specified working volume. Users are interested in the dynamic accuracy of their tools. The configuration of individual sensors into a unique tool, the calibration of the tool tip, and the motion of the tool contribute additional errors. Electromagnetic (EM) tracking systems are considered an enabling technology for many image guided procedures because they are not limited by line-of-sight restrictions, take minimum space in the operating room, and the sensors can be very small. It is often difficult to quantify the accuracy of EM trackers because they can be affected by field distortion from certain metal objects. Many high-accuracy measurement devices can affect the EM measurements being validated. EM Tracker accuracy tends to vary over the working volume and orientation of the sensors. We present several simple methods for estimating the dynamic accuracy of EM tracked tools. We discuss the characteristics of the EM Tracker used in the GE Healthcare family of surgical navigation systems. Results for other tracking systems are included.
There has been an increasing need for faster and more reliable inspection of nuclear reactor vessels during scheduled inspection/refueling/repair outages. The inspection of such a complicated environment presents many challenges. During scheduled outages, the inspection platform (in our system a remotely operated miniature submarine) must be piloted efficiently to remote inspection locations, images and measurements of inspection locations presented to the human inspector, past information about this location recalled and viewed, and decisions made regarding repair activity scheduling. We are developing a new integrated system that employs augmented reality techniques to allow the inspection system operator to efficiently and reliably carry out these tasks. We describe a system that creates a realtime animated synthetic image of the underwater environment being inspected (drawn from CAD models of reactor components) in which a synthesized image of the inspection platform moves. The image is created with respect to an operator selected viewing point. A sensor measures the position and orientation of the actual mini-submarine, and these data are used by the graphics computer to continuously update the animated image. The images to be viewed can be either two or three dimensional. This information is used to assist in guiding the vehicle through the environment. The system display also integrates current inspection data (such as live video images) with past video frames or with past inspection reports and past data to allow fast and reliable inspection decisions to be made. Examples of typical operator display screens are included.
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