Micro-transfer-printing (µTP) enables the intimate integration of diverse non-inherent functionalities on a target substrate and hence allows for the realization of complex photonic integrated circuits (PICs) with small footprint. By employing a polydimethylsiloxane (PDMS) elastomeric stamp with an array of posts, a large number of micro-components can be integrated on a target wafer in one transfer printing operation, which leads to substantial cost reduction of the resulting PICs. This paper discusses the use of µTP for the realization of III-V lasers on Si and SiN PICs and summarizes the recent progress that has been made in this field.
Flat panel displays are ubiquitous and dominated today by liquid crystal and OLED technologies. Increasingly, there is an expectation that microLED will exhibit superior performance metrics and become a new mainstream category of flat panel displays. They have the potential to be very bright, to be power efficient, and to enable new within-panel capabilities. High-throughput, high-yield, mass transfer technologies that accurately and cost-effectively integrate large arrays of wafer-fabricated microdevices onto non-native display substrates are key enablers for microLED displays. Transfer-printing with elastomer stamps is a candidate mass transfer technology for making next generation displays. A variety of microLED displays, including displays controlled with transfer-printed microICs, have been designed and fabricated using elastomer stamp transfer-printing.
Erich Radauscher, Matthew Meitl, Carl Prevatte, Salvatore Bonafede, Robert Rotzoll, David Gomez, Tanya Moore, Brook Raymond, Ronald Cok, Alin Fecioru, António Jose Trindade, Brent Fisher, Scott Goodwin, Paul Hines, George Melnik, Sam Barnhill, Christopher Bower
Inorganic light emitting diodes (LEDs) serve as bright pixel-level emitters in displays, from indoor/outdoor video walls with pixel sizes ranging from one to thirty millimeters to micro displays with more than one thousand pixels per inch. Pixel sizes that fall between those ranges, roughly 50 to 500 microns, are some of the most commercially significant ones, including flat panel displays used in smart phones, tablets, and televisions. Flat panel displays that use inorganic LEDs as pixel level emitters (μILED displays) can offer levels of brightness, transparency, and functionality that are difficult to achieve with other flat panel technologies. Cost-effective production of μILED displays requires techniques for precisely arranging sparse arrays of extremely miniaturized devices on a panel substrate, such as transfer printing with an elastomer stamp. Here we present lab-scale demonstrations of transfer printed μILED displays and the processes used to make them. Demonstrations include passive matrix μILED displays that use conventional off-the shelf drive ASICs and active matrix μILED displays that use miniaturized pixel-level control circuits from CMOS wafers. We present a discussion of key considerations in the design and fabrication of highly miniaturized emitters for μILED displays.
This work focuses on the effects of custom-designed, two-dimensional grating structures on the sensitivity of optical
waveguides biosensors in the input grating coupler configuration. Calculations suggest that suitably designed diffractive
structures with optimum pitch in two orthogonal directions can increase the sensitivity of devices when compared to a
conventional one-dimensional grating under the same conditions. A set of six diffractive structures designed for 1550 nm
wavelength were fabricated by thermal nano-imprint lithography on silicon oxynitride waveguides; the silicon master
stamp was patterned by deep UV stepper lithography. Preliminary experimental results indicate a sensitivity
enhancement of a factor two due to the 2D diffractive couplers.
Silicon oxynitride optical waveguides with a grating coupler were used for a label-free detection approach that measures the change of refractive index at the grating surface. Two approaches were used for the grating fabrication: (i) commercially available linear gratings were used as stamps for imprint lithography and the pattern was transferred by dry-etching; (ii) polystyrene microspheres self-assembly in an ordered close-packed array was exploited to obtain a two-dimensional grating with hexagonal symmetry. Optical coupling into slab waveguides of both visible (633nm) and tunable infrared (1550 nm) lasers was characterized as a function of incident angle in a custom-made automated apparatus. Sensitivity to different aqueous solutions was demonstrated with low loss waveguides fabricated using low-frequency plasma-enhanced chemical vapor deposition. The exploitation of the tunability of telecom infrared lasers and of the two-dimensional hexagonal grating coupler has the ultimate goal of providing a high performance, compact sensor that does not require mechanical moving parts.
Planar waveguide technology has long been touted as the major platform for optical integration, which could dramatically lower component/module size and cost in optical networks. This technology has finally come to maturity with such waveguide-based optical products as wavelength multiplexers, switches, splitters and couplers, which are common nowadays. However, its potential as a complete solution for integration of a subsystem on a chip has so far been limited by the lack of integrated active elements providing gain to deteriorating optical signals. As the signal propagates through the fiber-optic network, it dissipates its energy and requires amplification in the network subsystems to maintain a required signal to noise ratio. Discrete fiber amplifiers are designed into systems and maintain required signal levels. However, if new components are introduced or the current ones are changed, current amplifiers have a limited ability to compensate for changes. Inplane's solution to the signal degradation problem is an optical amplifier that can be integrated onto the same planar waveguide platform as the other passive elements of the subsystem. Subsystems on such a platform will be able to automatically and internally adjust signal optical power, and enable simple interfacing between optical modules, module replacement and upgrades in the network. Inplane Photonics has developed Er-doped waveguide amplifier (EDWA) technology, which is fully compatible with the glass-on-silicon waveguide platform. In this paper we will present recent EDWA performance that approaches that of a fiber amplifier. Furthermore, we will demonstrate several examples of practical integration between passive and active building blocks on a single optical chip.
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