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26 June 2015 Special Section Guest Editorial: Control of IC Patterning Variance Part 1: Metrology, Process Monitoring, and Control of Critical Dimension
Alexander Starikov, Matthew J. Sendelbach
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Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 14, Issue 2, 021101 (June 2015). https://doi.org/10.1117/1.JMM.14.2.021101
This PDF file contains the editorial “Special Section Guest Editorial: Control of IC Patterning Variance Part 1: Metrology, Process Monitoring, and Control of Critical Dimension” for JM3 Vol. 14 Issue 02
© 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
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Alexander Starikov and Matthew J. Sendelbach "Special Section Guest Editorial: Control of IC Patterning Variance Part 1: Metrology, Process Monitoring, and Control of Critical Dimension," Journal of Micro/Nanolithography, MEMS, and MOEMS 14(2), 021101 (26 June 2015). https://doi.org/10.1117/1.JMM.14.2.021101
Published: 26 June 2015
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KEYWORDS
Process control
Metrology
Critical dimension metrology
Electron beam lithography
Directed self assembly
Optical lithography
Optical proximity correction
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