Photonic-electronic ICs for machine intelligence: devices, architectures, chip packaging

Volker J. Sorger; Nicola Peserico; Hangbo Yang; Russell Schwartz

doi:10.1117/12.3028777

4 October 2024 Photonic-electronic ICs for machine intelligence: devices, architectures, chip packaging

Volker J. Sorger, Nicola Peserico, Hangbo Yang, Russell Schwartz

Proceedings Volume PC13118, Emerging Topics in Artificial Intelligence (ETAI) 2024; PC131180F (2024) https://doi.org/10.1117/12.3028777
Event: Nanoscience + Engineering, 2024, San Diego, California, United States

Abstract

This presentation covers the opportunities and challenges of photonic-electronic chip-based machine intelligence acceleration hardware. We will start with a review of device-level component performance specifications such as footprint, energy consumption, reconfiguration speed, for instance. Emerging materials, when integrated monolithically into photonic waveguide circuits, show promise for next generation opto-electronic components offering high FOMs, however have high barrier to entry in for foundry PDKs. Beyond devices, we will explore a variety of architectural choices, known as co-design optimization. Parallelization strategies, smart routing, optical hardware function implementation (e.g. Fourier transformation on-chip) will be covered. Next, we explore chip packaging options including ADK and digital-twin hardware in the loop optimizations thereof. Finally, examples of prototyping will be shared and application options discussed.

Conference Presentation

Citation Download Citation

Volker J. Sorger, Nicola Peserico, Hangbo Yang, and Russell Schwartz "Photonic-electronic ICs for machine intelligence: devices, architectures, chip packaging", Proc. SPIE PC13118, Emerging Topics in Artificial Intelligence (ETAI) 2024, PC131180F (4 October 2024); https://doi.org/10.1117/12.3028777

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KEYWORDS

Packaging

Photonic integrated circuits

Optoelectronics

Prototyping

Waveguides

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