Non-destructive crack detection in electronic devices using photoacoustic ultrasound

Seoin Han; Kyu Kwan Park; Hyoung Won Baac

doi:10.1117/12.3001473

12 March 2024 Non-destructive crack detection in electronic devices using photoacoustic ultrasound

Seoin Han, Kyu Kwan Park, Hyoung Won Baac

Proceedings Volume PC12893, Photonic Instrumentation Engineering XI; PC128930N (2024) https://doi.org/10.1117/12.3001473
Event: SPIE OPTO, 2024, San Francisco, California, United States

Conference Poster

Abstract

This study presents a non-destructive crack detection method for electronic devices using photoacoustic ultrasound. By utilizing a black ink film as a photoacoustic signal generator, cracks can be located and mapped with high precision. The technique uses the black ink film of the product and can detect small cracks of about 40 μm using a laser beam. This approach offers numerous industrial applications, enabling manufacturers to assess device condition, locate defects, and improve product quality without causing further damage. It has the potential to enhance user satisfaction by reducing malfunctions in electronic devices.

Citation Download Citation

Seoin Han, Kyu Kwan Park, and Hyoung Won Baac "Non-destructive crack detection in electronic devices using photoacoustic ultrasound", Proc. SPIE PC12893, Photonic Instrumentation Engineering XI, PC128930N (12 March 2024); https://doi.org/10.1117/12.3001473

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