Presentation
30 May 2022 On-chip near-infrared spectral sensor for nondestructive material analysis
Anne van Klinken, Fang Ou, Chenhui Li, Don M. J. van Elst, Maurangelo Petruzzella, Kaylee D. Hakkel, Francesco M. Pagliano, Petar Sevo, René P. J. van Veldhoven, Andrea Fiore
Author Affiliations +
Abstract
We demonstrate a novel, fully-integrated approach to spectral sensing in the near-infrared range suitable for analyzing the chemical composition of organic materials. The sensor consists of 16 detector pixels, each forming a resonant-cavity enhanced photodetector consisting of an InGaAs/InP photodiode and a tuning layer enclosed in a planar cavity formed by two metal mirrors. For wavelengths meeting the resonance condition of the optical cavity, the absorption in the photodiode is enhanced, which leads to a wavelength-specific response of the photodetector. As the thickness of the tuning layer is varied throughout the pixels, each of the 16 photodetectors features an individual complex spectral response with several peaks of about 50 nm linewidth and responsivity above 0.1 A/W. All pixels together cover the whole wavelength range from 900 nm to 1700 nm, allowing for the analysis of broad spectral features typical for diffuse reflectance spectra of organic materials in the near-infrared range. The photocurrents read-out from the spectral sensors can be combined with chemometric analysis methods to determine the material composition. We demonstrate the performance of the spectral sensor for the determinate of moisture in rice grains, leading to a coefficient of determination of R² = 0.97. Other demonstrated applications include the quantification of the sugar content in tomatoes, fat and protein content in raw cow milk and the classification of different types of plastic. With a size of 1.5 mm by 1.5mm and a fabrication scheme based on optical lithography, this on-chip spectral sensor yields potential for large-scale production. Together with the mechanical stability of the sensor, this approach is an important step towards portable, low-cost spectral sensing solutions.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Anne van Klinken, Fang Ou, Chenhui Li, Don M. J. van Elst, Maurangelo Petruzzella, Kaylee D. Hakkel, Francesco M. Pagliano, Petar Sevo, René P. J. van Veldhoven, and Andrea Fiore "On-chip near-infrared spectral sensor for nondestructive material analysis", Proc. SPIE PC12139, Optical Sensing and Detection VII, PC1213905 (30 May 2022); https://doi.org/10.1117/12.2620290
Advertisement
Advertisement
KEYWORDS
Sensors

Chemical analysis

Near infrared

Nondestructive evaluation

Materials analysis

Photodetectors

Photodiodes

Back to Top