Poster + Presentation
9 March 2022 Wafer-scale growth of hexagonal boron nitride passivation layer directly on III-nitride high-electron mobility transistor for radio-frequency operation
Author Affiliations +
Conference Poster
Abstract
Although gallium nitride (GaN)-based electronic devices for next-generation have garnered increasing attention over the last few years, the formation of surface defects, which severely deteriorate device performances, is fundamentally unavoidable and surface passivation is highly desired. Herein, we report the realization of the clean van der Waals passivation layer, 2D hexagonal boron nitride (h-BN), directly grown on AlGaN/GaN HEMT wafer by using Metal-Organic Chemical Vapor Deposition (MOCVD) system. It was found that the hetero-interface between ~2.5 nm-thick h-BN and AlGaN layer is the atomically sharp with very weak van der Waals interaction, observed by state-of-the-art microscopic and spectroscopic analyses in consistent with calculations.The wafer-scale direct growth of atomically-thin-yet-electrically- “thick” h-BN would be very beneficial for miniaturization of not only compound semiconductor devices but also Si-based electronic devices.
Conference Presentation
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Seokho Moon, Jaewon Kim, Jiye Kim, and Jong Kyu Kim "Wafer-scale growth of hexagonal boron nitride passivation layer directly on III-nitride high-electron mobility transistor for radio-frequency operation", Proc. SPIE PC12022, Light-Emitting Devices, Materials, and Applications XXVI, PC1202216 (9 March 2022); https://doi.org/10.1117/12.2611507
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KEYWORDS
Boron

Transistors

Field effect transistors

Compound semiconductors

Crystals

Electronic components

Fourier transforms

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