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5 March 2022 Low loss InP traveling wave amplifiers with U-bend waveguide for hybrid integration on silicon photonics platform
Heidi Tuorila, Jukka Viheriälä, Jae-Wung Lee, Mikko Harjanne, Matteo Cherchi, Timo Aalto, Mircea Guina
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Proceedings Volume PC12005, Smart Photonic and Optoelectronic Integrated Circuits 2022; PC120050B (2022) https://doi.org/10.1117/12.2609606
Event: SPIE OPTO, 2022, San Francisco, California, United States
Abstract
Development of InP-based U-bend waveguide gain chips for hybrid integration on silicon platform is presented. We utilize Euler bend geometry to ensure small footprint along with low losses. The geometry allows to bring the input and output on the same facet and is used to simplify alignment for lower coupling losses. The interface between bend and straight waveguide is inspected by comparing shallow and deep etched waveguide profiles. The effects of this interface and the bend geometry on the device losses, electric properties and spectrum are reported. Finally, the integration of U-bend gain chips on silicon-on-insulator platform is demonstrated.
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Heidi Tuorila, Jukka Viheriälä, Jae-Wung Lee, Mikko Harjanne, Matteo Cherchi, Timo Aalto, and Mircea Guina "Low loss InP traveling wave amplifiers with U-bend waveguide for hybrid integration on silicon photonics platform", Proc. SPIE PC12005, Smart Photonic and Optoelectronic Integrated Circuits 2022, PC120050B (5 March 2022); https://doi.org/10.1117/12.2609606
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KEYWORDS
Waveguides
Amplifiers
Silicon photonics
Gallium arsenide
Silicon
Inspection
Semiconductor lasers
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