Transmission laser bonding of low melting eutectic alloys

C. Hoff; K. Cromwell; J. Hermsdorf; M. Akin; M. C. Wurz; S. Kaierle; H. J. Maier; L. Overmeyer

doi:10.1117/12.2230399

24 March 2016 Transmission laser bonding of low melting eutectic alloys

C. Hoff, K. Cromwell, J. Hermsdorf, M. Akin, M. C. Wurz, S. Kaierle, H. J. Maier, L. Overmeyer

Proceedings Volume 9741, High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications V; 97410K (2016) https://doi.org/10.1117/12.2230399
Event: SPIE LASE, 2016, San Francisco, California, United States

Abstract

Transparent polymers with low glass transition temperatures are flexible materials and can serve as an optical waveguide or as substrates for the layer structure in applications such as humidity or temperature sensors. The background of this publication is the development of a laser-based process to bond silicon chips, which serve as emitter or detector in an optical system, on a substrate, without exposing the substrate to thermo-mechanical stress. Using transmission laser bonding of low-melting eutectic alloys, the necessary energy can be coupled into the fusion zone precisely to reduce the process time. In this paper, Si-chips with 52In48Sn and 66In34Bi layers are investigated to bond on rigid substrates. Experimental results are presented, which illustrate the mechanical stability of these compounds.

Citation Download Citation

C. Hoff, K. Cromwell, J. Hermsdorf, M. Akin, M. C. Wurz, S. Kaierle, H. J. Maier, and L. Overmeyer "Transmission laser bonding of low melting eutectic alloys", Proc. SPIE 9741, High-Power Laser Materials Processing: Lasers, Beam Delivery, Diagnostics, and Applications V, 97410K (24 March 2016); https://doi.org/10.1117/12.2230399

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