Optimization of polyetherimide processing parameters for optical interconnect applications

Wei Zhao; Peter Johnson; Christopher Wall

doi:10.1117/12.2202829

12 October 2015 Optimization of polyetherimide processing parameters for optical interconnect applications

Wei Zhao, Peter Johnson, Christopher Wall

Proceedings Volume 9633, Optifab 2015; 96332K (2015) https://doi.org/10.1117/12.2202829
Event: SPIE Optifab, 2015, Rochester, New York, United States

Abstract

ULTEM® polyetherimide (PEI) resins have been used in opto-electronic markets since the optical properties of these materials enable the design of critical components under tight tolerances. PEI resins are the material of choice for injection molded integrated lens applications due to good dimensional stability, near infrared (IR) optical transparency, low moisture uptake and high heat performance. In most applications, parts must be produced consistently with minimal deviations to insure compatibility throughout the lifetime of the part. With the large number of lenses needed for this market, injection molding has been optimized to maximize the production rate. These optimized parameters for high throughput may or may not translate to an optimized optical performance.
In this paper, we evaluate and optimize PEI injection molding processes with a focus on optical property performance. A commonly used commercial grade was studied to determine factors and conditions which contribute to optical transparency, color, and birefringence. Melt temperature, mold temperature, injection speed and cycle time were varied to develop optimization trials and evaluate optical properties. These parameters could be optimized to reduce in-plane birefringence from 0.0148 to 0.0006 in this study. In addition, we have studied an optically smooth, sub-10nm roughness mold to re-evaluate material properties with minimal influence from mold quality and further refine resin and process effects for the best optical performance.

Citation Download Citation

Wei Zhao, Peter Johnson, and Christopher Wall "Optimization of polyetherimide processing parameters for optical interconnect applications", Proc. SPIE 9633, Optifab 2015, 96332K (12 October 2015); https://doi.org/10.1117/12.2202829

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available