Paper
18 March 2015 Hybrid OPC flow with pattern search and replacement
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Abstract
Optical Proximity Correction (OPC) is a compute-intensive process used to generate photolithography mask shapes at advanced VLSI nodes. Previously, we reported a modified two-step OPC flow which consists of a first pattern replacement step followed by a model based OPC correction step [1]. We build on this previous work and show how this hybrid flow not only improves full chip OPC runtime, but also significantly improves mask correction consistency and overall mask quality. This is demonstrated using a design from the 20nm node, which requires the use of model based SRAF followed by model based OPC to obtain the full mask solution.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Piyush Verma, Shikha Somani, Yang Y. Ping, Piyush Pathak, Rani S. Ghaida, Carl P. Babcock, Fadi Batarseh, Jingyu Wang, Sriram Madhavan, and Sarah McGowan "Hybrid OPC flow with pattern search and replacement", Proc. SPIE 9426, Optical Microlithography XXVIII, 942611 (18 March 2015); https://doi.org/10.1117/12.2087094
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Cited by 4 scholarly publications.
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KEYWORDS
Optical proximity correction

Photomasks

SRAF

Photovoltaics

Model-based design

Very large scale integration

Data modeling

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