Paper
19 March 2015 Real time decision based multiple mode SEM review imaging solution
Huina Xu, Harsh Sinha, Garry Chen, White Pai, Jung Yan Yang, Charles Tsai
Author Affiliations +
Abstract
Embedded defect types continue to be a challenge for scanning electron microscopes (SEM) review solutions. Though high energy beams can be used to image these defect types, they cause damage to the reviewed sites. Also, imaging all review sites at higher electron energy has often resulted in low topography surface defects to be non-visible due to high penetration depth. In this work we present a method in which defects are reviewed at non-destructive lower electron energies and only the non-visual review sites are reviewed at higher electron energies to image any potential additional defect types. The non-visual defects are identified inline during review using automatic defect classification attributes.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Huina Xu, Harsh Sinha, Garry Chen, White Pai, Jung Yan Yang, and Charles Tsai "Real time decision based multiple mode SEM review imaging solution", Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94242G (19 March 2015); https://doi.org/10.1117/12.2086505
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KEYWORDS
Scanning electron microscopy

Semiconducting wafers

Optical inspection

Inspection

Nondestructive evaluation

Real time imaging

Wafer-level optics

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