High-density silicon optical interposer for inter-chip interconnects

T. Nakamura; Y. Urino; Y. Arakawa

doi:10.1117/12.2052891

1 May 2014 High-density silicon optical interposer for inter-chip interconnects

T. Nakamura, Y. Urino, Y. Arakawa

Proceedings Volume 9133, Silicon Photonics and Photonic Integrated Circuits IV; 91330R (2014) https://doi.org/10.1117/12.2052891
Event: SPIE Photonics Europe, 2014, Brussels, Belgium

Abstract

We introduce a photonics-electronics convergence system and a silicon optical interposer in this system. We developed the optical components for the silicon optical interposer and achieved a high-bandwidth-density silicon optical interposer of 30 Tbps/cm² with a channel line rate of 20 Gbps.

Citation Download Citation

T. Nakamura, Y. Urino, and Y. Arakawa "High-density silicon optical interposer for inter-chip interconnects", Proc. SPIE 9133, Silicon Photonics and Photonic Integrated Circuits IV, 91330R (1 May 2014); https://doi.org/10.1117/12.2052891

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