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The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon. Please use the following format to cite material from this book: Author(s), “Title of Paper,” in Advanced Etch Technology for Nanopatterning III, edited by Gottlieb S. Oehrlein, Qinghuang Lin, Proceedings of SPIE Vol. 9054 (SPIE, Bellingham, WA, 2014) Article CID Number. ISSN: 0277-786X ISBN: 9780819499776 Published by SPIE P.O. Box 10, Bellingham, Washington 98227-0010 USA Telephone +1 360 676 3290 (Pacific Time)· Fax +1 360 647 1445 Copyright © 2014, Society of Photo-Optical Instrumentation Engineers. Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of copying fees. The Transactional Reporting Service base fee for this volume is $18.00 per article (or portion thereof), which should be paid directly to the Copyright Clearance Center (CCC), 222 Rosewood Drive, Danvers, MA 01923. Payment may also be made electronically through CCC Online at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher. The CCC fee code is 0277-786X/14/$18.00. Printed in the United States of America. Publication of record for individual papers is online in the SPIE Digital Library.
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Session Chairs
IntroductionThis proceedings volume contains selected papers presented at the conference Advanced Etch Technology for Nanopatterning III held February 24-25, 2014 as part of the SPIE Advanced Lithography Symposium 2014. The meeting featured six sessions of oral presentations to highlight important achievements and challenges in the following areas of Advanced Etch Technology for Nanopatterning: Session 1: Reviews and Overviews of Nanopatterning Challenges Session 2: Nanopatterning for Advanced Logic and Memory Technology Nodes Session 3: Plasma and Resist Interactions, Including Patterning Quality Control (LER, CD Uniformity, etc.) Session 4: Patterning Integration Schemes (multilayer patterning, self-aligned patterning, etc.) Session 5: New Plasma Sources and New Etching Technologies Session 6: Emerging Patterning Technologies (DSA and others) Additionally, there was a poster session. We would like to thank all speakers and presenters for their stimulating contributions to the conference. We also would like to express our gratitude to the SPIE Advanced Lithography “Advanced Etch Technology for Nanopatterning III” Conference Committee members for their contributions in organizing this very successful conference. Finally, we would like to thank SPIE and its staff for support of this conference and their arrangements. Gottlieb S. Oehrlein Qinghuang Lin |
