A layout decomposition algorithm for self-aligned multiple patterning

Jun You; Hongyi Liu; Yijian Chen

doi:10.1117/12.2046390

28 March 2014 A layout decomposition algorithm for self-aligned multiple patterning

Jun You, Hongyi Liu, Yijian Chen

Proceedings Volume 9053, Design-Process-Technology Co-optimization for Manufacturability VIII; 905310 (2014) https://doi.org/10.1117/12.2046390
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

Self-aligned multiple patterning (SAMP) is a promising technology to scale IC devices to 7-nm half pitch and several 3- mask negative-tone SAMP processes for 2-D BEOL patterning applications have been proposed recently. In this paper, the existing coloring rules in self-aligned quadruple and sextuple patterning (SAQP and SASP) processes are reexamined first. We further discuss the geometric relation between various features and remove the unnecessary constraints, and develop improved layout decomposition algorithms for both processes. The cut-mask related overlay issue is addressed by proposing an edge-expansion solution when generating the cut patterns. Finally, we show that numerous standard M1 cells in the Open Cell Library, when slightly modified, can be successfully decomposed. This verifies the functionality of the new decomposition algorithms for continuous logic scaling to deep nano-scale using SAMP techniques.

Citation Download Citation

Jun You, Hongyi Liu, and Yijian Chen "A layout decomposition algorithm for self-aligned multiple patterning", Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 905310 (28 March 2014); https://doi.org/10.1117/12.2046390

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