Demonstrating production quality multiple exposure patterning aware routing for the 10NM node

Lars Liebmann; Vassilios Gerousis; Paul Gutwin; Mike Zhang; Geng Han; Brian Cline

doi:10.1117/12.2045958

28 March 2014 Demonstrating production quality multiple exposure patterning aware routing for the 10NM node

Lars Liebmann, Vassilios Gerousis, Paul Gutwin, Mike Zhang, Geng Han, Brian Cline

Proceedings Volume 9053, Design-Process-Technology Co-optimization for Manufacturability VIII; 905309 (2014) https://doi.org/10.1117/12.2045958
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

This paper reviews the escalation in design constraints imposed on 2^nd level wiring by multiple patterning exposure techniques in the 10NM technology node (i.e. ~45nm wiring pitch) relative to the 14NM technology node (i.e. 64nm wiring pitch). Specifically, new challenges facing place-and-route tooling are outlined, solutions to overcome these challenges are reviewed, and a manufacturing ready implementation is demonstrated.

Citation Download Citation

Lars Liebmann, Vassilios Gerousis, Paul Gutwin, Mike Zhang, Geng Han, and Brian Cline "Demonstrating production quality multiple exposure patterning aware routing for the 10NM node", Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 905309 (28 March 2014); https://doi.org/10.1117/12.2045958

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